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公开(公告)号：US20240302107A1
公开(公告)日：2024-09-12
申请号：US18669641
申请日：2024-05-21
发明人： Dingguo ZHOU , Xuemei WANG , Jen-Chih CHENG
CPC分类号： F28D15/043 , B23P15/26 , F28D15/0283
摘要： This disclosure relates to a manufacturing method of a vapor chamber that includes the following steps. Form a containing space and a flow channel on a first cover. Place a second cover on the first cover, such that the first cover and the second cover together form a chamber at the containing space of the first cover and form a passage at the flow channel of the first cover. Enlarge part of the passage so as to create a circular passage portion and a flat passage portion in the passage. Insert a degassing tube into the circular passage portion of the passage. Draw gas from the chamber and fill working fluid into the chamber via the degassing tube. Seal a joint between the chamber and the flat passage portion by a resistance-welding process. Cut off parts of the first cover and the second cover that surround the passage.
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公开(公告)号：US11988453B2
公开(公告)日：2024-05-21
申请号：US17666537
申请日：2022-02-07
发明人： Ryan J. Lewis , Ronggui Yang , Yung-Cheng Lee
IPC分类号： F28D15/02 , F28D15/04 , H01L23/427 , H05K7/20
CPC分类号： F28D15/0283 , F28D15/0233 , F28D15/04 , H01L23/427 , H05K7/20336 , F28D15/0241 , F28F2265/00
摘要： Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.
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公开(公告)号：US11885571B2
公开(公告)日：2024-01-30
申请号：US17105101
申请日：2020-11-25
发明人： Jen-Chih Cheng
IPC分类号： F28D15/02
CPC分类号： F28D15/0266 , F28D15/025 , F28D15/0283 , F28D2015/0216
摘要： A pulsating vapor chamber has an inner board, a first outer board, a second outer board, an asymmetric loop, and a working fluid. The inner board has a first surface and a second surface. The first and second outer boards are mounted on the first surface and the second surface of the inner board respectively. The asymmetric loop is located between the first and second outer boards and has multiple channels communicating with each other in sequence. A part of the channels are formed between the first outer board and the inner board, and the remaining channels are formed between the second outer board and the inner board. With the asymmetric loop, even if the vapor chamber is disposed horizontally, pressure may be changed by different amount in the channels so that the working fluid is still able to oscillate or circulate.
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公开(公告)号：US20230366632A1
公开(公告)日：2023-11-16
申请号：US18026299
申请日：2021-01-28
发明人： Quanyao YU , Pingping LIANG , Xuehua LI , Guang CHEN
IPC分类号： F28D15/02
CPC分类号： F28D15/0283 , F28F2275/06 , F28F2225/02 , F28F2230/00
摘要： A manufacturing method for a vapor chamber, a vapor chamber and a middle frame vapor chamber are disclosed. The manufacturing method for a vapor chamber includes preparing different raw materials for various parts of the vapor chamber, and machining and molding the various parts according to predetermined shapes of the various parts by using corresponding raw materials, assembling the machined and molded various parts of the vapor chamber, and welding and sealing the assembled various parts of the vapor chamber, performing a surface heat treatment on the vapor chamber, performing a passivating treatment on the vapor chamber, assembling the vapor chamber, injecting water into the vapor chamber assembled with the liquid injection pipe, vacuumizing the vapor chamber injected with water, performing a sealing treatment on the vacuumized vapor chamber, and welding the vapor chamber with a reinforcing rib.
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公开(公告)号：US11815314B2
公开(公告)日：2023-11-14
申请号：US17575629
申请日：2022-01-13
发明人： Cheng-Hua Li , Ping-Hung He , Chia-Ling Chin
CPC分类号： F28D15/0233 , B22F3/1103 , B23P15/26 , F28D15/0283 , F28D15/046 , H05K7/20336 , B23P2700/09
摘要： An integrated vapor chamber includes an outer shell and a plurality of composite capillary structures. The outer shell includes a flat casing and a plurality of partitions integrally formed. The flat shell includes a chamber, and the partitions are disposed in the chamber to separate the chamber into a plurality of flow channels. Each composite capillary structure is extended along each flow channel and distributed in the chamber. The composite capillary structure includes a metal mesh and a plurality of sintered powder uniformly sintered in the metal mesh. Furthermore, this disclosure also discloses a manufacturing method of the integrated vapor chamber. Therefore, the manufacturing method of the thin vapor chamber is simplified to improve the yield rate.
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公开(公告)号：US11802738B2
公开(公告)日：2023-10-31
申请号：US15733464
申请日：2019-02-04
CPC分类号： F28D15/0275 , E03B11/02 , F28D15/0283
摘要： A water cooling system for showers has a water tank filled with water to be cooled, and a heat exchange loop which includes an internal heat exchange (HX) evaporator immersed into the water within the water tank, and a condenser HX unit positioned externally above the internal evaporator unit. A refrigerant in the loop absorbs the heat from the water in the water tank, circulates in the HX loop, and passes to the condenser HX unit to release heat to ambient air. The water cooling process is passive and does not require any form of external energy. The subject heat transport attains a minimal thermal resistance by two-phase evaporation and condensation process (heat piping) which achieves positive flow at as low as 0.2° C.-1° C. temperature difference between the ambient air and the tank water.
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公开(公告)号：US20230194187A1
公开(公告)日：2023-06-22
申请号：US18173581
申请日：2023-02-23
发明人： Chi-Lung CHEN
CPC分类号： F28D15/04 , F28D15/046 , F28D15/0233 , F28D15/0283 , H01L23/427
摘要： A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.
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公开(公告)号：US20190234691A1
公开(公告)日：2019-08-01
申请号：US15880529
申请日：2018-01-26
发明人： Chun-Hung LIN
CPC分类号： F28D15/0283 , F28D15/0275 , F28D15/04 , F28D2021/0028 , F28F3/12
摘要： A thermal module includes a vapor chamber (1) and a cooling plate (2) placed on a surface (100) of the vapor chamber (1). The cooling plate (2) includes a board (20) and a half-pipe member (21). The board (20) has a combination surface (200) and a cooling surface (201), the combination surface (200) is attached to the vapor chamber (1), and the half-pipe member (21) is integrally formed with the board (20) on its cooling surface (201). The half-pipe member (21) is recessed into the combination surface (200) of the board (20) and protruded from the cooling surface (201). Therefore, the half-pipe member (21) can improve heat dissipation, and the board (20) is in face-to-face contact with the vapor chamber (1) to provide a good sealing effect and facilitate easy production.
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公开(公告)号：US20190078815A1
公开(公告)日：2019-03-14
申请号：US15893811
申请日：2018-02-12
发明人： Takuya HONGO , Rei KIMURA , Tomonao TAKAMATSU , Chikako IWAKI , Hideki HORIE
CPC分类号： F25B39/00 , F25B23/006 , F25B39/02 , F25B39/04 , F25B47/006 , F25B2600/027 , F28D15/025 , F28D15/0258 , F28D15/0266 , F28D15/0275 , F28D15/0283 , F28D15/06 , F28D2021/0029 , F28D2021/0054 , G21C15/02 , G21C15/28 , H01L23/427
摘要： According to one embodiment, a heat transport apparatus includes an evaporator, a cooling unit, a channel structure, and a heating mechanism. The evaporator vaporizes a refrigerant by heat generated by a heat-generating element. The cooling unit is provided above the evaporator and cools and condenses the refrigerant vaporized in the evaporator. The channel structure constitutes a channel through which the refrigerant circulates between the evaporator and the cooling unit. The heating mechanism heats the cooling unit and suppresses solidification of the refrigerant at the cooling unit.
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公开(公告)号：US20180320985A1
公开(公告)日：2018-11-08
申请号：US15969985
申请日：2018-05-03
CPC分类号： F28D15/046 , F28D15/0233 , F28D15/0283 , F28D2015/0225 , F28D2021/0028 , F28D2021/005
摘要： A polymer-based heat transfer device comprising a polymer-based housing having housing walls defining a working fluid chamber, a porous structure extending in the working fluid chamber from at least one of the two opposed ones of the housing walls, and a plurality of housing wall spacers, such as support posts, extending between the two housing walls to maintain the two housing walls in a spaced-apart configuration with the working fluid chamber extending in between is provided. Also described is a polymer-based heat transfer device comprising a polymer-based housing having housing walls defining a working fluid chamber and a porous structure extending in the working fluid chamber from at least one of the two opposed ones of the housing walls, and heat-conductive metal or ceramic-based foam contacting at least one of the housing walls. A process for manufacturing the polymer-based heat transfer device is provided.
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