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    THERMAL MODULE
    1.
    发明申请
    THERMAL MODULE 审中-公开

    公开(公告)号：US20190234691A1

    公开(公告)日：2019-08-01

    申请号：US15880529

    申请日：2018-01-26

    申请人： TAIWAN MICROLOOPS CORP.

    发明人： Chun-Hung LIN

    IPC分类号： F28D15/02 ,  F28D15/04 ,  F28F3/12

    CPC分类号： F28D15/0283 ,  F28D15/0275 ,  F28D15/04 ,  F28D2021/0028 ,  F28F3/12

    摘要： A thermal module includes a vapor chamber (1) and a cooling plate (2) placed on a surface (100) of the vapor chamber (1). The cooling plate (2) includes a board (20) and a half-pipe member (21). The board (20) has a combination surface (200) and a cooling surface (201), the combination surface (200) is attached to the vapor chamber (1), and the half-pipe member (21) is integrally formed with the board (20) on its cooling surface (201). The half-pipe member (21) is recessed into the combination surface (200) of the board (20) and protruded from the cooling surface (201). Therefore, the half-pipe member (21) can improve heat dissipation, and the board (20) is in face-to-face contact with the vapor chamber (1) to provide a good sealing effect and facilitate easy production.

    POLYMER-BASED HEAT TRANSFER DEVICE AND PROCESS FOR MANUFACTURING THE SAME
    3.
    发明申请
    POLYMER-BASED HEAT TRANSFER DEVICE AND PROCESS FOR MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20180320985A1

    公开(公告)日：2018-11-08

    申请号：US15969985

    申请日：2018-05-03

    申请人： SOCPRA SCIENCES ET GENIE S.E.C.

    发明人： Mahmoodreza SALIM SHIRAZY ,  Luc G. FRECHETTE

    IPC分类号： F28D15/04 ,  F28D15/02

    CPC分类号： F28D15/046 ,  F28D15/0233 ,  F28D15/0283 ,  F28D2015/0225 ,  F28D2021/0028 ,  F28D2021/005

    摘要： A polymer-based heat transfer device comprising a polymer-based housing having housing walls defining a working fluid chamber, a porous structure extending in the working fluid chamber from at least one of the two opposed ones of the housing walls, and a plurality of housing wall spacers, such as support posts, extending between the two housing walls to maintain the two housing walls in a spaced-apart configuration with the working fluid chamber extending in between is provided. Also described is a polymer-based heat transfer device comprising a polymer-based housing having housing walls defining a working fluid chamber and a porous structure extending in the working fluid chamber from at least one of the two opposed ones of the housing walls, and heat-conductive metal or ceramic-based foam contacting at least one of the housing walls. A process for manufacturing the polymer-based heat transfer device is provided.

    SERIAL THERMOSYPHON
    5.
    发明申请
    SERIAL THERMOSYPHON 审中-公开

    公开(公告)号：US20180231326A1

    公开(公告)日：2018-08-16

    申请号：US15896416

    申请日：2018-02-14

    申请人： J R Thermal LLC

    发明人： Jeremy Rice

    IPC分类号： F28D15/02 ,  H01L23/427

    CPC分类号： F28D15/0266 ,  F28D15/025 ,  F28D15/0275 ,  F28D15/0283 ,  F28F2250/08 ,  H01L23/427

    摘要： A thermosyphon having a condenser located below the evaporator, or an evaporator above the condenser, is presented. Various embodiments include serially configured evaporators and condensers, so that the excess pressure head from any condenser to evaporator liquid coupling may be utilized to overcome deficient pressure head in a subsequent condenser to evaporator liquid coupling.

    VAPOR CHAMBER
    8.
    发明申请
    VAPOR CHAMBER 审中-公开
    蒸气室

    公开(公告)号：US20170059254A1

    公开(公告)日：2017-03-02

    申请号：US14867613

    申请日：2015-09-28

    申请人： CHAMP TECH OPTICAL (FOSHAN) CORPORATION ,  Foxconn Technology Co., Ltd.

    发明人： JING ZHANG ,  TAO LI ,  MING-WEI CHEN

    IPC分类号： F28D15/04

    CPC分类号： F28D15/0233 ,  F28D15/0283 ,  H01L23/427

    摘要： A vapor chamber includes a condensation board and an evaporation board. The evaporation board includes an evaporation surface. The condensation board includes a condensation surface. A groove is defined on the condensation surface. The groove is sealed up by the condensation board and the evaporation board therebetween with the evaporation surface facing the condensation surface. A plurality of isolation boards are positioned in the groove. The groove is divided into a plurality of separated cavities by the isolation boards.

    摘要翻译： 蒸气室包括冷凝板和蒸发板。 蒸发板包括蒸发表面。 冷凝板包括冷凝表面。 在冷凝表面上形成凹槽。 凹槽由冷凝板和蒸发板密封，蒸发表面面向冷凝表面。 多个隔离板位于槽中。 槽通过隔离板分成多个分离的空腔。

    COOLING DEVICE FOR AN ELECTRIC MOTOR
    9.
    发明申请
    COOLING DEVICE FOR AN ELECTRIC MOTOR 有权
    电动马达的冷却装置

    公开(公告)号：US20160226345A1

    公开(公告)日：2016-08-04

    申请号：US15021690

    申请日：2014-09-03

    申请人： SIEMENS AKTIENGESELLSCHAFT

    发明人： Esteban Grau Sorarrain ,  Christian Jäkel ,  Mario Koebe ,  Matthias Kowalski ,  Christoph Lehmann ,  Andrey Mashkin ,  Olga Plotnikova ,  Carolin Schild

    IPC分类号： H02K9/20

    CPC分类号： H02K9/20 ,  F28D15/02 ,  F28D15/0275 ,  F28D15/0283

    摘要： A cooling device for an electric motor includes at least one closed capillary tube, within which a cooling fluid is located and which is introduced into an opening of a lamination stack of the electric motor such that the capillary tube is connected to the lamination stack to conduct heat and partially projects out of the lamination stack, such that the capillary tube has a cold end disposed outside and a hot end disposed inside the lamination stack. The cooling fluid and the degree of filling of the capillary tube with the cooling fluid is chosen such that an input of heat from the lamination stack into the capillary tube leads to evaporation of the cooling fluid, and the cold end of the capillary tube is cooled such that vapour produced during the evaporation condenses and heat input into the capillary tube is dissipated out of the capillary tube.

    摘要翻译： 一种用于电动机的冷却装置包括至少一个封闭的毛细管，冷却流体位于该密闭的毛细管内，并且被引入到电动机的层压叠层的开口中，使得毛细管连接到层压叠层以进行 加热并部分地突出出层压叠层，使得毛细管具有设置在外部的冷端和设置在层压叠层内的热端。 选择冷却流体和具有冷却流体的毛细管的填充程度，使得从层压叠层进入毛细管的热量的输入导致冷却流体的蒸发，并且毛细管的冷端被冷却 使得在蒸发冷凝期间产生的蒸气和热量输入毛细管中的蒸气从毛细管中散出。

    BOILING HEAT TRANSFER DEVICE
    10.
    发明申请
    BOILING HEAT TRANSFER DEVICE 审中-公开
    锅炉换热装置

    公开(公告)号：US20160209120A1

    公开(公告)日：2016-07-21

    申请号：US15082143

    申请日：2016-03-28

    申请人： Hitoshi SAKAMOTO ,  Minoru YOSHIKAWA ,  Takeya HASHIGUCHI

    发明人： Hitoshi SAKAMOTO ,  Minoru YOSHIKAWA ,  Takeya HASHIGUCHI

    IPC分类号： F28D15/02 ,  F28F3/02 ,  F28D1/02

    CPC分类号： F28D15/0266 ,  F28D1/024 ,  F28D15/0283 ,  F28D2015/0216 ,  F28F3/02 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A boiling heat transfer device of the present invention includes: a heat receiving portion that boils a liquefied refrigerant to convert it to vapor, and contacts with a device to be cooled and cools the device to be cooled; a vapor tube that connects to an upper portion of the heat receiving portion and conveys the vapor generated by the heat receiving portion; a heat dissipating portion that condenses the vapor conveyed from the vapor tube to convert it to a liquefied refrigerant and dissipates heat to an atmosphere; and a liquid tube that returns to the heat receiving portion the liquefied refrigerant condensed by the heat dissipating portion. At least a portion of a cross-sectional area of a flow passage of the vapor in the heat receiving portion gradually decreases from a lower portion of the heat receiving portion toward the upper portion of the heat receiving portion.

    摘要翻译： 本发明的沸腾传热装置包括：热接收部分，其使液化的制冷剂沸腾以将其转化为蒸汽，并与待冷却的装置接触并冷却待冷却的装置; 蒸气管，其连接到所述受热部的上部，并且传送由所述受热部产生的蒸气; 散热部，其冷凝从蒸气管输送的蒸气，将其转化为液化的制冷剂，并将热量散发到大气中; 以及液体管，其使由所述散热部冷凝的液化制冷剂返回到所述受热部。 受热部中的蒸气的流路的截面积的至少一部分从受热部的下部朝向受热部的上部逐渐减小。