Hanging grounded structure
    3.
    发明授权

    公开(公告)号:US11678443B2

    公开(公告)日:2023-06-13

    申请号:US17492882

    申请日:2021-10-04

    CPC classification number: H05K5/0026

    Abstract: A hanging grounded structure is disclosed and includes a housing, a recessed portion and a hanging groove. The housing includes an opening facing a first direction and a lateral wall extended along a second direction. The lateral wall has a top edge located at a periphery of the opening. The recessed portion is recessed inwardly on the lateral wall. The hanging groove is disposed on the lateral wall and located in the recessed portion. A grounded wire is hung on the housing through the hanging groove. The hanging groove includes a starting point located at the top edge and an ending point. A curved path is formed from the starting point to the ending point. The grounded wire is hung from an interior of the housing. An end of the grounded wire is disposed in the recessed portion through the hanging groove.

    ELECTRONIC DEVICE AND GROUNDING STRUCTURE THEREOF

    公开(公告)号:US20230232526A1

    公开(公告)日:2023-07-20

    申请号:US17720069

    申请日:2022-04-13

    CPC classification number: H05K1/0215 H05K7/12 H05K7/1417

    Abstract: An electronic device is provided and includes a circuit board and a casing. The circuit board includes a plate body, a perforation and a ground wire. The perforation penetrates through the plate body, the ground wire is electrically coupled with the plate body and crosses over the perforation. The casing includes a bottom plate and a clamping structure. The clamping structure is disposed on the bottom plate and includes a first clamping part and a second clamping part. The circuit board is disposed in the casing, and the clamping structure penetrates through the plate body through the perforation, so that the circuit board is positioned on the casing, and the ground wire is clamped by the first clamping part and the second clamping part of the clamping structure. Consequently, the circuit board is grounded with the casing.

    Waterproof casing
    5.
    发明授权

    公开(公告)号:US11147180B2

    公开(公告)日:2021-10-12

    申请号:US16799665

    申请日:2020-02-24

    Abstract: A waterproof casing for packaging a circuit board is provided. The circuit board comprises an antenna. The waterproof casing comprises a metallic casing, a non-metallic end cover and a sealing gasket. The metallic casing comprises an accommodation space and a side opening in communication with each other. The accommodation space is configured to accommodate the circuit board. The antenna is adjacent to the side opening. The non-metallic end cover covers the side opening and combined with the metallic casing to form a sealed box. The non-metallic end cover comprises a ring-shaped install portion disposed on a surface thereof and extending outwardly from the surface. The ring-shaped install portion is disposed in the accommodation space as the non-metallic end cover covers the side opening. The sealing gasket is disposed around the ring-shaped install portion. A joint between the metallic casing and the non-metallic end cover is sealed by the sealing gasket.

    WATERPROOF CASING
    6.
    发明申请
    WATERPROOF CASING 审中-公开

    公开(公告)号:US20200221600A1

    公开(公告)日:2020-07-09

    申请号:US16799665

    申请日:2020-02-24

    Abstract: A waterproof casing for packaging a circuit board is provided. The circuit board comprises an antenna. The waterproof casing comprises a metallic casing, a non-metallic end cover and a sealing gasket. The metallic casing comprises an accommodation space and a side opening in communication with each other. The accommodation space is configured to accommodate the circuit board. The antenna is adjacent to the side opening. The non-metallic end cover covers the side opening and combined with the metallic casing to form a sealed box. The non-metallic end cover comprises a ring-shaped install portion disposed on a surface thereof and extending outwardly from the surface. The ring-shaped install portion is disposed in the accommodation space as the non-metallic end cover covers the side opening. The sealing gasket is disposed around the ring-shaped install portion. A joint between the metallic casing and the non-metallic end cover is sealed by the sealing gasket.

    Power supply
    7.
    外观设计

    公开(公告)号:USD993177S1

    公开(公告)日:2023-07-25

    申请号:US29817316

    申请日:2021-11-30

    Abstract: FIG. 1 is a perspective view of a power supply showing our new design;
    FIG. 2 is another perspective view thereof;
    FIG. 3 is a front elevational view thereof;
    FIG. 4 is a rear elevational view thereof;
    FIG. 5 is a left side elevational view thereof;
    FIG. 6 is a right side elevational view thereof;
    FIG. 7 is a top plan view thereof; and,
    FIG. 8 is a bottom plan view thereof.
    The broken lines shown represent the portions of the power supply that form no part of the claimed design.

    HANGING GROUNDED STRUCTURE
    8.
    发明申请

    公开(公告)号:US20230048184A1

    公开(公告)日:2023-02-16

    申请号:US17492882

    申请日:2021-10-04

    Abstract: A hanging grounded structure is disclosed and includes a housing, a recessed portion and a hanging groove. The housing includes an opening facing a first direction and a lateral wall extended along a second direction. The lateral wall has a top edge located at a periphery of the opening. The recessed portion is recessed inwardly on the lateral wall. The hanging groove is disposed on the lateral wall and located in the recessed portion. A grounded wire is hung on the housing through the hanging groove. The hanging groove includes a starting point located at the top edge and an ending point. A curved path is formed from the starting point to the ending point. The grounded wire is hung from an interior of the housing. An end of the grounded wire is disposed in the recessed portion through the hanging groove.

    Electronic device and grounding structure thereof

    公开(公告)号:US11991818B2

    公开(公告)日:2024-05-21

    申请号:US17720069

    申请日:2022-04-13

    CPC classification number: H05K1/0215 H05K7/12 H05K7/1417

    Abstract: An electronic device is provided and includes a circuit board and a casing. The circuit board includes a plate body, a perforation and a ground wire. The perforation penetrates through the plate body, the ground wire is electrically coupled with the plate body and crosses over the perforation. The casing includes a bottom plate and a clamping structure. The clamping structure is disposed on the bottom plate and includes a first clamping part and a second clamping part. The circuit board is disposed in the casing, and the clamping structure penetrates through the plate body through the perforation, so that the circuit board is positioned on the casing, and the ground wire is clamped by the first clamping part and the second clamping part of the clamping structure. Consequently, the circuit board is grounded with the casing.

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