公开(公告)号：US20240023275A1

公开(公告)日：2024-01-18

申请号：US18117087

申请日：2023-03-03

Applicant: Delta Electronics, Inc.

Inventor： Yi-You Hu ,  Cheng-Tang Yeh ,  Li-Kuang Tan

IPC: H05K7/20

CPC classification number: H05K7/20254 ,  H05K7/20272 ,  H05K7/20263 ,  H05K7/20409

Abstract: A liquid cooling heat dissipation system is provided. The system includes a first heat dissipation device, a first heat absorption device, a second heat dissipation device, a second heat absorption device, and a pump connected with the first heat dissipation device, the first heat absorption device, the second heat dissipation device or the second heat absorption device. The first heat dissipation device, the first heat absorption device, the second heat dissipation device and the second heat absorption device are connected in sequence.