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公开(公告)号：US11306974B2
公开(公告)日：2022-04-19
申请号：US15624300
申请日：2017-06-15
Applicant: DELTA ELECTRONICS, INC.
Inventor： Li-Kuang Tan , Shih-Kang Lin
IPC: F28D15/02 , F28D15/04 , F28F3/06 , H01L33/64 , H01L23/427 , F28F9/007 , F28D21/00 , F21V29/74 , F21Y115/10 , H01L23/367
Abstract: A temperature plate includes a plate body and at least two supporters. The plate body has a first plate and a second plate, and a vacuum chamber is defined by the first plate and the second plate. The first plate has a first external surface, and the plate body is bent to form at least two bent portions with the first external surface being a compressive side, and the supporters are disposed inside the vacuum chamber and connected to an inner wall of the vacuum chamber to enhance a structural strength of the bent portions and also to improve heat conduction, wherein the temperature plate is combined with a cooling fin assembly, the cooling fin assembly is disposed on the first external surface. When the number of the bent portions are two, the configuration of the two bent portions allows the plate body to clip the cooling fin assembly.
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公开(公告)号：US11236948B2
公开(公告)日：2022-02-01
申请号：US16820662
申请日：2020-03-16
Applicant: DELTA ELECTRONICS, INC.
Inventor： Wei-Fang Wu , Li-Kuang Tan
Abstract: A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.
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公开(公告)号：US10663231B2
公开(公告)日：2020-05-26
申请号：US15615140
申请日：2017-06-06
Applicant: DELTA ELECTRONICS, INC.
Inventor： Li-Kuang Tan , Shih-Kang Lin
IPC: F28D15/02 , F28D15/04 , H01L23/373 , H01L21/48 , H01L23/427 , B23P15/26 , H01L23/367
Abstract: A manufacturing method of a heat conducting device includes following steps: providing a first plate, which includes a plate body and at least a heat conducting element, wherein the plate body has at least an inserting end disposed corresponding to the heat conducting element and defining a tube, and the heat conducting element is mounted at the tube; providing a second plate, which has a first opening end; disposing a first wick structure on an internal wall of the heat conducting element and a bottom surface of the plate body; disposing a second wick structure on an internal wall of the second plate; and connecting the plate body to the first opening end so as to connect the first plate and the second plate to form a chamber. Accordingly, the heat conducting device has a higher heat conducting efficiency.
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公开(公告)号：US11788802B2
公开(公告)日：2023-10-17
申请号：US17337444
申请日：2021-06-03
Applicant: DELTA ELECTRONICS, INC.
Inventor： Yu-Jei Huang , Li-Kuang Tan
CPC classification number: F28F9/0278 , F28D1/05391 , F28F9/0282
Abstract: A water cooling device includes a first collector, a second collector and a plurality of tubes. The first collector includes a receiving chamber and a plurality of distribution chamber. The receiving chamber has an inlet for receiving a working fluid. Each of the distribution chambers includes a first wall portion and a second wall portion opposite to the first wall portion. The first wall portion has an opening communicating with the receiving chamber. The second wall portion has an outlet. Each of the tubes is connected to the outlet of one of the distribution chambers on one end, and is connected to the second collector on another end.
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公开(公告)号：US12156377B2
公开(公告)日：2024-11-26
申请号：US17476267
申请日：2021-09-15
Applicant: Delta Electronics, Inc.
Inventor： Li-Kuang Tan , Sung Tsang
IPC: H05K7/20
Abstract: The disclosure relates to an immersion cooling system including a tank, an access opening, a first dielectric liquid, a working object and a condensing unit. The tank has a space and a cover. The cover is detachably disposed on the tank to close or open the space selectively. The access opening is in communication with the space of the tank. The first dielectric liquid is accommodated within the space to form a liquid surface. The liquid surface and the access opening are disposed adjacent to each other. The working object is immersed in the first dielectric liquid. The condensing unit is arranged in the space above the liquid surface. When a cooling operation is performed, the access opening is closed, the first dielectric liquid is kept in the space, and the heat generated from the working object is dissipated through the first dielectric liquid and the condensing unit.
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Patent Agency Ranking
公开(公告)号：US20240023275A1
公开(公告)日：2024-01-18
申请号：US18117087
申请日：2023-03-03
Applicant: Delta Electronics, Inc.
Inventor： Yi-You Hu , Cheng-Tang Yeh , Li-Kuang Tan
IPC: H05K7/20
CPC classification number: H05K7/20254 , H05K7/20272 , H05K7/20263 , H05K7/20409
Abstract: A liquid cooling heat dissipation system is provided. The system includes a first heat dissipation device, a first heat absorption device, a second heat dissipation device, a second heat absorption device, and a pump connected with the first heat dissipation device, the first heat absorption device, the second heat dissipation device or the second heat absorption device. The first heat dissipation device, the first heat absorption device, the second heat dissipation device and the second heat absorption device are connected in sequence.
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公开(公告)号：US11549760B2
公开(公告)日：2023-01-10
申请号：US17646148
申请日：2021-12-28
Applicant: DELTA ELECTRONICS, INC.
Inventor： Wei-Fang Wu , Li-Kuang Tan
Abstract: A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.
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公开(公告)号：US09847273B2
公开(公告)日：2017-12-19
申请号：US13945376
申请日：2013-07-18
Applicant: DELTA ELECTRONICS, INC.
Inventor： Yu-Hsien Lin , Li-Kuang Tan
CPC classification number: H01L23/4093 , F16B2/08 , F16B2/22 , Y10T403/595
Abstract: A clip for fixing a heat sink on a retaining bracket includes an elastic supporter, an operating member, a movable fastener and a fixing bar. Two ends of the elastic supporter have a connecting portion and a first buckle portion, respectively. The operating member has a resisting portion, a pivot portion and an operating bar. The pivot portion pivots to the connecting portion. The movable fastener installs on the resisting portion and the connecting portion, and includes two sliding slots, a resisting surface and a second buckle portion. The resisting portion has an arc surface for resisting against the resisting surface. The distance between the apex of the arc surface and the pivot portion is the largest distance between the arc surface and the pivot portion. When the clip is locked, the junction of the resisting portion and the resisting surface excludes the apex of the arc surface.
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公开(公告)号：US12284784B2
公开(公告)日：2025-04-22
申请号：US17887669
申请日：2022-08-15
Applicant: Delta Electronics, Inc.
Inventor： Shih-Kang Lin , Li-Kuang Tan
Abstract: A hot-swappable pump unit (HSPU) and a coolant distribution unit (CDU) using the same are disclosed. The HSPU is connected to a loop inlet element, a loop outlet element and a fixed component of CDU along a matching direction. The HSPU includes a housing, a pump, a pump inlet element, a pump outlet element and a fastening component. The pump inlet element is in communication with the pump by passing through a first lateral wall of the housing. The pump outlet element is in communication with the pump by passing through the first lateral wall. The fastening component is arranged on the housing and configured to engage with the fixed component, to drive the hosing to move along the matching direction. Whereby, the pump inlet element and the loop outlet element are matched and connected, and the pump outlet element and the loop inlet element are matched and connected.
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公开(公告)号：US12209825B2
公开(公告)日：2025-01-28
申请号：US18453327
申请日：2023-08-22
Applicant: DELTA ELECTRONICS, INC.
Inventor： Yu-Jei Huang , Li-Kuang Tan
Abstract: A water cooling device includes a first collector, a second collector and a plurality of tubes. The first collector includes a receiving chamber and a plurality of distribution chamber. The receiving chamber has an inlet for receiving a working fluid. Each of the distribution chambers includes a first wall portion and a second wall portion opposite to the first wall portion. The first wall portion has an opening communicating with the receiving chamber. The second wall portion has an outlet. Each of the tubes is connected to the outlet of one of the distribution chambers on one end, and is connected to the second collector on another end.
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