COVER TAPE AND ELECTRONIC-COMPONENT PACKAGE
    1.
    发明公开

    公开(公告)号:US20230271761A1

    公开(公告)日:2023-08-31

    申请号:US18040173

    申请日:2021-08-18

    CPC classification number: B65D75/28

    Abstract: This cover tape has at least a base layer and a heat seal layer, wherein the heat seal layer contains a copolymer (A) of a styrene-based hydrocarbon and a conjugated diene-based hydrocarbon, the component (A) contains a block copolymer (A-1) of 10% by mass or more and less than 50% by mass of a styrene-based hydrocarbon and more than 50% by mass and 90% by mass or less of a conjugated diene-based hydrocarbon, and a block copolymer (A-2) of 50% by mass or more and 95% by mass or less of a styrene-based hydrocarbon and 5% by mass or more and 50% by mass or less of a conjugated diene-based hydrocarbon, a content of the component (A-1) is 35 to 60% by mass based on a total amount of the heat seal layer, and a mass ratio of the component (A-2) to the component (A-1) is 0.30 to 1.0.

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