公开(公告)号：US4857131A

公开(公告)日：1989-08-15

申请号：US125852

申请日：1987-11-27

申请人： Dennis J. Damico ,  Kenneth W. Mushrush ,  Ruth M. Bennett

发明人： Dennis J. Damico ,  Kenneth W. Mushrush ,  Ruth M. Bennett

IPC分类号： C09J4/06

CPC分类号： C09J4/06

摘要： A two-part, heat stable, peroxide-free adhesive that can be mixed in equal parts with rapid cure for the bonding of plastics and metals has been discussed. Part A of the adhesive contains a polymeric material, an olefinically unsaturated monomer, an acid material, a compound containing a sulfonyl halide group, and a compound containing a transition metal; and Part B contains a polymeric material (preferably a phenoxy resin) and monomer of the same class and a Zn, Cu or Cd metal powder.

摘要翻译： 已经讨论了两部分，热稳定的，无过氧化物的粘合剂，其可以等量混合，快速固化以用于粘合塑料和金属。 粘合剂的部分A包含聚合物材料，烯属不饱和单体，酸性材料，含有磺酰卤基团的化合物和含有过渡金属的化合物; 和B部分含有聚合材料（优选苯氧基树脂）和相同类别的单体和Zn，Cu或Cd金属粉末。