公开(公告)号：US09548223B2

公开(公告)日：2017-01-17

申请号：US13336685

申请日：2011-12-23

申请人： Dieter Frank ,  Robert Rogatschnig ,  Andreas Gleissner

发明人： Dieter Frank ,  Robert Rogatschnig ,  Andreas Gleissner

IPC分类号： H01L21/67 ,  H01L21/687

CPC分类号： H01L21/67051 ,  H01L21/6708 ,  H01L21/67115 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/68728 ,  Y10T29/41

摘要： A device and method for processing wafer-shaped articles comprises a process chamber and a rotary chuck located within the process chamber. The rotary chuck is adapted to be driven without physical contact through a magnetic bearing. The rotary chuck comprises a series of gripping pins adapted to hold a wafer shaped article in a position depending downwardly from the rotary chuck. The rotary chuck further comprises a plate that rotates together with the rotary chuck. The plate is positioned above an area occupied by the wafer-shaped article, and shields upper surfaces of the process chamber from liquids flung off of a wafer-shaped article during use of the rotary chuck.

摘要翻译： 用于处理晶片形物品的装置和方法包括位于处理室内的处理室和旋转卡盘。 旋转卡盘适于被驱动而不通过磁轴承进行物理接触。 旋转卡盘包括一系列夹紧销，其适于将晶片成形制品保持在从旋转卡盘向下悬挂的位置。 旋转卡盘还包括与旋转卡盘一起旋转的板。 板被定位在晶片状物品占据的区域的上方，并且在旋转卡盘的使用过程中，屏蔽处理室的上表面免受从晶片状物品溅出的液体。

公开(公告)号：US20130160260A1

公开(公告)日：2013-06-27

申请号：US13336685

申请日：2011-12-23

申请人： Dieter Frank ,  Robert Rogatschnig ,  Andreas Gleissner

发明人： Dieter Frank ,  Robert Rogatschnig ,  Andreas Gleissner

IPC分类号： H01L21/687 ,  B08B7/04

CPC分类号： H01L21/67051 ,  H01L21/6708 ,  H01L21/67115 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/68728 ,  Y10T29/41

摘要： A device and method for processing wafer-shaped articles comprises a process chamber and a rotary chuck located within the process chamber. The rotary chuck is adapted to be driven without physical contact through a magnetic bearing. The rotary chuck comprises a series of gripping pins adapted to hold a wafer shaped article in a position depending downwardly from the rotary chuck. The rotary chuck further comprises a plate that rotates together with the rotary chuck. The plate is positioned above an area occupied by the wafer-shaped article, and shields upper surfaces of the process chamber from liquids flung off of a wafer-shaped article during use of the rotary chuck.

摘要翻译： 用于处理晶片形物品的装置和方法包括位于处理室内的处理室和旋转卡盘。 旋转卡盘适于被驱动而不通过磁轴承进行物理接触。 旋转卡盘包括一系列夹紧销，其适于将晶片成形制品保持在从旋转卡盘向下悬挂的位置。 旋转卡盘还包括与旋转卡盘一起旋转的板。 板被定位在晶片状物品占据的区域的上方，并且在旋转卡盘的使用过程中，屏蔽处理室的上表面免受从晶片状物品溅出的液体。