公开(公告)号：US08222910B2

公开(公告)日：2012-07-17

申请号：US12504308

申请日：2009-07-16

申请人： Dilip Sangam ,  Hendrik Santo ,  Sean Chen ,  Minjong Kim ,  Sivaprakash Kannan ,  Balaji Virajpet

发明人： Dilip Sangam ,  Hendrik Santo ,  Sean Chen ,  Minjong Kim ,  Sivaprakash Kannan ,  Balaji Virajpet

IPC分类号： G01R31/02

CPC分类号： G01R31/3163 ,  G01R31/3187

摘要： The innovation relates to systems and/or methodologies for error detection during sub-assembly in high voltage analog circuits. A signal driver communicates test signals to one or more high voltage analog circuits, and a state machine compares the electrical and/or thermal responses of the high voltage analog circuits to a set of predetermined expected results (e.g., signatures). The signal driver and state machine can be incorporated into the high voltage analog circuits. The expected results can be stored in the target circuits in the form of look-up tables, matrices, and so forth. Errors, such as, dry solders and bridge solders can be determined based on the comparison of the obtained responses to the expected signatures.

摘要翻译： 该创新涉及用于在高压模拟电路中的子组装期间的错误检测的系统和/或方法。 信号驱动器将测试信号传送到一个或多个高压模拟电路，并且状态机将高压模拟电路的电和/或热响应与一组预定的预期结果（例如，签名）进行比较。 信号驱动器和状态机可以并入高压模拟电路。 预期结果可以以查询表，矩阵等的形式存储在目标电路中。 可以根据获得的对预期签名的响应的比较来确定干焊料和桥焊机等错误。

公开(公告)号：US20110012609A1

公开(公告)日：2011-01-20

申请号：US12504308

申请日：2009-07-16

申请人： Dilip S ,  Hendrik Santo ,  Sean Chen ,  Minjong Kim ,  Sivaprakash Kannan ,  Balaji Virajpet

发明人： Dilip S ,  Hendrik Santo ,  Sean Chen ,  Minjong Kim ,  Sivaprakash Kannan ,  Balaji Virajpet

IPC分类号： G01R31/02

CPC分类号： G01R31/3163 ,  G01R31/3187

摘要： The innovation relates to systems and/or methodologies for error detection during sub-assembly in high voltage analog circuits. A signal driver communicates test signals to one or more high voltage analog circuits, and a state machine compares the electrical and/or thermal responses of the high voltage analog circuits to a set of predetermined expected results (e.g., signatures). The signal driver and state machine can be incorporated into the high voltage analog circuits. The expected results can be stored in the target circuits in the form of look-up tables, matrices, and so forth. Errors, such as, dry solders and bridge solders can be determined based on the comparison of the obtained responses to the expected signatures.

摘要翻译： 该创新涉及用于在高压模拟电路中的子组装期间的错误检测的系统和/或方法。 信号驱动器将测试信号传送到一个或多个高压模拟电路，并且状态机将高压模拟电路的电和/或热响应与一组预定的预期结果（例如，签名）进行比较。 信号驱动器和状态机可以并入高压模拟电路。 预期结果可以以查询表，矩阵等的形式存储在目标电路中。 可以根据获得的对预期签名的响应的比较来确定干焊料和桥焊机等错误。