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1.发明申请公开(公告)号：US20130249759A1
公开(公告)日：2013-09-26
申请号：US13989636
申请日：2011-11-28
IPC分类号： H01Q9/06
摘要： A compact antenna and a communication apparatus using the same are provided. An antenna includes a strip-shaped conductor in which a plurality of strip-shaped m-th order elements, where m is an integer of 3 or more, are sequentially connected to one another. Herein n-th order elements constituting the strip-shaped conductor, where n is all integers equal to or more than 2 and equal to or less than m, are configured to be p n-th order elements into which an (n−1)-th order element is divided, where p is an integer of 3 or more, and the n-th order elements divided into p have bent shapes at respective boundary parts between the n-th order elements and are located so that a vector direction from one end of the (n−1)-th order element to the other end thereof does not vary. A compact high-performance antenna is obtained.
摘要翻译： 提供一种小型天线及使用其的通信装置。 天线包括条状导体，其中m是3或更大的整数的多个条形m阶元件彼此顺序连接。 这里，构成条形导体的n个全部为2以上且m以下的整数的n个元件构成为p（n-1）个元素， 被分割，其中p是3或更大的整数，并且被划分为p的n个元素在n个元素之间的各个边界部分具有弯曲形状，并且被定位成使得从 第（n-1）个元件的另一端的一端不变化。 获得了紧凑的高性能天线。
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2.发明授权High-frequency module and method of manufacturing the same, and transmitter, receiver, transceiver, and radar apparatus comprising the high-frequency module 失效高频模块及其制造方法以及包括高频模块的发射机，接收机，收发机和雷达装置公开(公告)号：US08564477B2
公开(公告)日：2013-10-22
申请号：US12935889
申请日：2009-03-31
IPC分类号： G01S13/00
CPC分类号： G01S7/032 , H01P3/121 , H01P5/107 , Y10T29/49128
摘要： A high-frequency module according to the present embodiment includes a substrate, a circuit board, and a waveguide. The substrate has an input-output portion for high-frequency signals on one surface thereof. The circuit board has a dielectric waveguide line with its end face exposed, and is placed on the one surface of the substrate such that a virtual plane extending beyond the end face is intersected by the one surface of the substrate. The waveguide has openings at ends thereof, in which one of the openings is connected to the end face of the dielectric waveguide line, and the other opening is connected to the input-output portion of the substrate.
摘要翻译： 根据本实施例的高频模块包括基板，电路板和波导。 衬底在其一个表面上具有用于高频信号的输入 - 输出部分。 电路板具有其端面露出的介电波导线，并且被放置在基板的一个表面上，使得延伸超过端面的虚拟平面与基板的一个表面相交。 波导在其端部具有开口，其中一个开口连接到电介质波导线的端面，另一个开口连接到基板的输入 - 输出部分。
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3.发明授权High-frequency module and method of manufacturing the same, and transmitter, receiver, transceiver, and radar apparatus comprising the high-frequency module 失效高频模块及其制造方法以及包括高频模块的发射机，接收机，收发机和雷达装置公开(公告)号：US08564478B2
公开(公告)日：2013-10-22
申请号：US12935893
申请日：2009-03-31
IPC分类号： G01S13/00
摘要： A high-frequency module according to the present embodiment includes a substrate, a circuit board, and a resonator. The substrate has an input-output portion for high-frequency signals formed on one surface thereof. The circuit board includes a dielectric waveguide line with its end face exposed, and is placed on the one surface of the substrate such that a virtual plane extending beyond the end face is intersected by the one surface of the substrate. The resonator includes input-output end portions for high-frequency signals at ends thereof, in which one of the input-output end portions is connected to the end face of the dielectric waveguide line, and the other thereof is connected to the input-output portion of the substrate.
摘要翻译： 根据本实施例的高频模块包括基板，电路板和谐振器。 基板具有形成在其一个表面上的高频信号的输入输出部分。 电路板包括其端面暴露的介质波导线，并且被放置在基板的一个表面上，使得延伸超过端面的虚拟平面与基板的一个表面相交。 谐振器包括用于其端部的高频信号的输入输出端部，其中输入输出端部中的一个连接到电介质波导线的端面，另一个连接到输入 - 输出 部分基板。
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