-
1.发明申请公开(公告)号：US20130249759A1
公开(公告)日：2013-09-26
申请号：US13989636
申请日：2011-11-28
IPC分类号： H01Q9/06
摘要： A compact antenna and a communication apparatus using the same are provided. An antenna includes a strip-shaped conductor in which a plurality of strip-shaped m-th order elements, where m is an integer of 3 or more, are sequentially connected to one another. Herein n-th order elements constituting the strip-shaped conductor, where n is all integers equal to or more than 2 and equal to or less than m, are configured to be p n-th order elements into which an (n−1)-th order element is divided, where p is an integer of 3 or more, and the n-th order elements divided into p have bent shapes at respective boundary parts between the n-th order elements and are located so that a vector direction from one end of the (n−1)-th order element to the other end thereof does not vary. A compact high-performance antenna is obtained.
摘要翻译： 提供一种小型天线及使用其的通信装置。 天线包括条状导体，其中m是3或更大的整数的多个条形m阶元件彼此顺序连接。 这里，构成条形导体的n个全部为2以上且m以下的整数的n个元件构成为p（n-1）个元素， 被分割，其中p是3或更大的整数，并且被划分为p的n个元素在n个元素之间的各个边界部分具有弯曲形状，并且被定位成使得从 第（n-1）个元件的另一端的一端不变化。 获得了紧凑的高性能天线。
-
2.发明授权公开(公告)号：US08159316B2
公开(公告)日：2012-04-17
申请号：US12681087
申请日：2008-12-27
申请人： Kentaro Miyazato , Kazuki Hayata , Yuji Kishida
发明人： Kentaro Miyazato , Kazuki Hayata , Yuji Kishida
IPC分类号： H01P3/00
摘要： The invention relates to a high-frequency transmission line connection structure, a circuit board having the connection structure, a high-frequency module having the circuit board, and a radar apparatus. A first laminated waveguide sub-line part (21) includes a pair of main conductor layers that oppose each other in a thickness direction with a dielectric layer (31) having the same thickness as a dielectric layer (31) of a microstrip line (1) interposed therebetween. A second laminated waveguide sub-line part (22) includes dielectric layers (31, 32) thicker than the dielectric layer of the first laminated waveguide sub-line part (21). A laminated waveguide main-line part (23) includes dielectric layers (31, 32, 33) thicker than the dielectric layers of the second laminated waveguide sub-line part (22). A conversion part (10) connected to the microstrip line (1) is formed by integrating with an upper main conductor layer constituting the respective line parts.
摘要翻译： 本发明涉及高频传输线连接结构，具有连接结构的电路板，具有电路板的高频模块和雷达装置。 第一层叠波导子线部分（21）包括在厚度方向上彼此相对的一对主导体层，其中电介质层（31）具有与微带线（1）的介电层（31）相同的厚度 ）。 第二层叠波导子线部分（22）包括比第一层叠波导子线部分（21）的电介质层厚的电介质层（31,32）。 叠层波导主线部分（23）包括比第二层叠波导子线部分（22）的介电层厚的电介质层（31,32,33）。 连接到微带线（1）的转换部分（10）通过与构成各个线路部分的上部主导体层集成而形成。
-
3.发明申请公开(公告)号：US20100245155A1
公开(公告)日：2010-09-30
申请号：US12681087
申请日：2008-12-27
申请人： Kentaro Miyazato , Kazuki Hayata , Yuji Kishida
发明人： Kentaro Miyazato , Kazuki Hayata , Yuji Kishida
摘要： The invention relates to a high-frequency transmission line connection structure, a circuit board having the connection structure, a high-frequency module having the circuit board, and a radar apparatus. A first laminated waveguide sub-line part (21) includes a pair of main conductor layers that oppose each other in a thickness direction with a dielectric layer (31) having the same thickness as a dielectric layer (31) of a microstrip line (1) interposed therebetween. A second laminated waveguide sub-line part (22) includes dielectric layers (31, 32) thicker than the dielectric layer of the first laminated waveguide sub-line part (21). A laminated waveguide main-line part (23) includes dielectric layers (31, 32, 33) thicker than the dielectric layers of the second laminated waveguide sub-line part (22). A conversion part (10) connected to the microstrip line (1) is formed by integrating with an upper main conductor layer constituting the respective line parts.
摘要翻译： 本发明涉及高频传输线连接结构，具有连接结构的电路板，具有电路板的高频模块和雷达装置。 第一层叠波导子线部分（21）包括在厚度方向上彼此相对的一对主导体层，其中电介质层（31）具有与微带线（1）的介电层（31）相同的厚度 ）。 第二层叠波导子线部分（22）包括比第一层叠波导子线部分（21）的电介质层厚的电介质层（31,32）。 叠层波导主线部分（23）包括比第二层叠波导子线部分（22）的介电层厚的电介质层（31,32,33）。 连接到微带线（1）的转换部分（10）通过与构成各个线路部分的上部主导体层集成而形成。
-
-
搜索结果
3 条记录 (耗时 0.011 秒)
