公开(公告)号：US20080093962A1

公开(公告)日：2008-04-24

申请号：US11575292

申请日：2005-08-26

申请人： Do-Hyung Kim ,  Moo-Whan Shin ,  Woong-Joon Hwang ,  Chung-Hoon Lee

发明人： Do-Hyung Kim ,  Moo-Whan Shin ,  Woong-Joon Hwang ,  Chung-Hoon Lee

IPC分类号： H01J7/24 ,  H01J9/00

CPC分类号： H01L33/648 ,  F28D15/02 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/15724 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention relates to a luminous device with a heat pipe formed therein and a heat pipe lead for a luminous device. The present invention provides a luminous device including a heat pipe lead or electrode and a luminous chip mounted onto the heat pipe lead or electrode. The luminous device of the present invention further comprises a heat dissipation member, such as a heat radiating plate or thermoelectric device, installed at an end of the heat pipe lead or electrode. Therefore, through the heat pipe lead or electrode of the present invention, a higher heat dissipation effect greater can be obtained as compared with the conventional one. As a result, it is possible to reduce thermal stress on a luminous device and to prevent the occurrence of a phenomenon in which external impurities penetrate into the luminous device. In addition, the cooling efficiency and the light-emitting efficiency of a luminous chip can be maximized by further disposing a heat dissipation member outside the heat pipe.

摘要翻译： 本发明涉及一种其中形成有热管的发光装置和用于发光装置的热管引线。 本发明提供一种发光装置，其包括热管引线或电极以及安装在热管引线或电极上的发光芯片。 本发明的发光装置还包括安装在热管引线或电极的端部的诸如散热板或热电装置的散热构件。 因此，通过本发明的热管引线或电极，与以往相比，能够得到较大的散热效果。 结果，可以降低发光器件上的热应力，并且防止外部杂质渗透到发光器件中的现象的发生。 此外，通过在散热管外部进一步布置散热构件，可以使发光芯片的冷却效率和发光效率最大化。