公开(公告)号：US08373996B2

公开(公告)日：2013-02-12

申请号：US12499067

申请日：2009-07-07

申请人： Donald J. Pavinski, Jr. ,  August Spannagel ,  Charles H. Joyner ,  Peter W. Evans ,  Matthew Fisher ,  Mark J. Missey

发明人： Donald J. Pavinski, Jr. ,  August Spannagel ,  Charles H. Joyner ,  Peter W. Evans ,  Matthew Fisher ,  Mark J. Missey

IPC分类号： H05K7/00

CPC分类号： H01L23/49833 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

摘要： Consistent with an aspect of the present disclosure, a package is provided that has a carrier and first and second substrates provided on the carrier. Conductive traces are provided on the first substrate (upper traces) and below it (lower traces) to provide two levels of electrical connectivity to a photonic integrated circuit (PIC) provided on the second substrate. As a result, an increased number of connections can be made to the PIC in a relatively small package, while maintaining adequate spacing and line widths for each trace. In addition, the lower traces are connected to bonding pads on the surface of the first substrate and are thus provided in the same plane as the upper traces. Testing of and access to both upper and lower traces is thus simplified.

摘要翻译： 根据本公开的一个方面，提供了一种包装，其具有载体和设置在载体上的第一和第二基板。 导电迹线设置在第一衬底（上部迹线）上和其下方（下部迹线）上，以提供与设置在第二衬底上的光子集成电路（PIC）的两级电连接。 结果，可以在相对较小的封装中对PIC进行更多数量的连接，同时为每个迹线保持适当的间隔和线宽。 此外，下部迹线连接到第一基板的表面上的接合焊盘，并且因此设置在与上部迹线相同的平面中。 因此，简化了上下轨道的测试和访问。

公开(公告)号：US20110007486A1

公开(公告)日：2011-01-13

申请号：US12499067

申请日：2009-07-07

申请人： Donald J. Pavinski ,  August Spannagel ,  Charles H. Joyner ,  Peter W. Evans ,  Matthew Fisher ,  Mark J. Missey

发明人： Donald J. Pavinski ,  August Spannagel ,  Charles H. Joyner ,  Peter W. Evans ,  Matthew Fisher ,  Mark J. Missey

IPC分类号： H05K7/00

CPC分类号： H01L23/49833 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

摘要： Consistent with an aspect of the present disclosure, a package is provided that has a carrier and first and second substrates provided on the carrier. Conductive traces are provided on the first substrate (upper traces) and below it (lower traces) to provide two levels of electrical connectivity to a photonic integrated circuit (PIC) provided on the second substrate. As a result, an increased number of connections can be made to the PIC in a relatively small package, while maintaining adequate spacing and line widths for each trace. In addition, the lower traces are connected to bonding pads on the surface of the first substrate and are thus provided in the same plane as the upper traces. Testing of and access to both upper and lower traces is thus simplified.

摘要翻译： 根据本公开的一个方面，提供了一种包装，其具有载体和设置在载体上的第一和第二基板。 导电迹线设置在第一衬底（上部迹线）上和其下方（下部迹线）上，以提供与设置在第二衬底上的光子集成电路（PIC）的两级电连接。 结果，可以在相对较小的封装中对PIC进行更多数量的连接，同时为每个迹线保持适当的间隔和线宽。 此外，下部迹线连接到第一基板的表面上的接合焊盘，并且因此设置在与上部迹线相同的平面中。 因此，简化了上下轨道的测试和访问。