OLED LIGHTING DEVICES INCLUDING ELECTRODES WITH MAGNETIC MATERIAL
    3.
    发明申请
    OLED LIGHTING DEVICES INCLUDING ELECTRODES WITH MAGNETIC MATERIAL 有权
    含有磁性材料的电极的OLED照明装置

    公开(公告)号:US20100295443A1

    公开(公告)日:2010-11-25

    申请号:US12470067

    申请日:2009-05-21

    IPC分类号: H01J1/62

    摘要: An article of manufacture comprises a thin film solid state lighting device, such as an organic light emitting diode (OLED) device, having a planar light emitting side and an opposite planar mounting side and including electrodes disposed on the planar mounting side of the thin film solid state lighting device, the electrodes including a magnetic material configured to conductively convey electrical drive current to drive the thin film solid state lighting device to emit light at the planar light emitting principal side. The article of manufacture may further comprise a fixture having a planar surface with magnets arranged to mate with the electrodes to magnetically secure the thin film solid state lighting device with the fixture and to concurrently form electrically conductive paths including the magnetic material of the electrodes configured to conductively convey electrical drive current. Thus this magnetic connection provides both mechanical support and electrical conduction path.

    摘要翻译: 一种制品包括具有平面发光侧和相对的平面安装侧的薄膜固态照明装置,例如有机发光二极管(OLED)装置,并且包括设置在薄膜的平面安装侧的电极 固态照明装置,所述电极包括被配置为导电地传送电驱动电流以驱动所述薄膜固态照明装置在所述平面发光主面发光的磁性材料。 制品可以进一步包括具有平面表面的夹具,磁体布置成与电极配合,以用固定装置固定薄膜固态照明装置,同时形成包括电极的磁性材料的导电路径, 传导电驱动电流。 因此,该磁连接提供机械支撑和导电路径。

    OLED lighting devices including electrodes with magnetic material
    4.
    发明授权
    OLED lighting devices including electrodes with magnetic material 有权
    OLED照明装置包括具有磁性材料的电极

    公开(公告)号:US08450926B2

    公开(公告)日:2013-05-28

    申请号:US12470067

    申请日:2009-05-21

    IPC分类号: H01L51/50

    摘要: An article of manufacture comprises a thin film solid state lighting device, such as an organic light emitting diode (OLED) device, having a planar light emitting side and an opposite planar mounting side and including electrodes disposed on the planar mounting side of the thin film solid state lighting device, the electrodes including a magnetic material configured to conductively convey electrical drive current to drive the thin film solid state lighting device to emit light at the planar light emitting principal side. The article of manufacture may further comprise a fixture having a planar surface with magnets arranged to mate with the electrodes to magnetically secure the thin film solid state lighting device with the fixture and to concurrently form electrically conductive paths including the magnetic material of the electrodes configured to conductively convey electrical drive current. Thus this magnetic connection provides both mechanical support and electrical conduction path.

    摘要翻译: 一种制品包括具有平面发光侧和相对的平面安装侧的薄膜固态照明装置,例如有机发光二极管(OLED)装置,并且包括设置在薄膜的平面安装侧的电极 固态照明装置,所述电极包括被配置为导电地传送电驱动电流以驱动所述薄膜固态照明装置在所述平面发光主面发光的磁性材料。 制品可以进一步包括具有平面表面的夹具,磁体布置成与电极配合,以用固定装置固定薄膜固态照明装置,同时形成包括电极的磁性材料的导电路径, 传导电驱动电流。 因此,该磁连接提供机械支撑和导电路径。

    HERMETIC ELECTRICAL PACKAGE
    5.
    发明申请
    HERMETIC ELECTRICAL PACKAGE 审中-公开
    电磁电气包装

    公开(公告)号:US20100294526A1

    公开(公告)日:2010-11-25

    申请号:US12470033

    申请日:2009-05-21

    IPC分类号: H05K5/06 B05D5/12 B32B3/10

    摘要: A hermetic electrical package includes a first transparent barrier layer; a second barrier layer bonded to the first barrier layer, and defining a plurality of feedthrough apertures; an optoelectronic device sandwiched between the first and second barrier layers, the optoelectronic device comprising an anode, a photoelectrically active layer, and a cathode; and a conductive patch electrically coupled to the cathode or anode and disposed across at least one feedthrough aperture.

    摘要翻译: 密封电气包装包括第一透明阻挡层; 结合到第一阻挡层的第二阻挡层,并且限定多个馈通孔; 夹在所述第一和第二阻挡层之间的光电器件,所述光电器件包括阳极,光电活性层和阴极; 以及导电贴片,其电耦合到阴极或阳极并跨过至少一个馈通孔布置。

    ENCAPSULATION STRUCTURE AND METHOD OF ORGANIC ELECTROLUMINESCENCE DEVICE
    6.
    发明申请
    ENCAPSULATION STRUCTURE AND METHOD OF ORGANIC ELECTROLUMINESCENCE DEVICE 有权
    有机电致发光器件的封装结构与方法

    公开(公告)号:US20100148661A1

    公开(公告)日:2010-06-17

    申请号:US12336683

    申请日:2008-12-17

    IPC分类号: H01L51/50 H01L51/56

    摘要: An encapsulation structure comprises a first barrier layer, and an electroluminescence device configured to be coupled to the first barrier layer and comprising a substrate and an electroluminescence element both defining a lateral side. The electroluminescence element comprises a first electrode disposed on the substrate, a second electrode, and an organic light-emitting layer disposed between the first and second electrodes. Further, the encapsulation structure comprises a second barrier layer configured to be coupled to the electroluminescence device, and an adhesive configured to locate between and connect the first and second barrier layers, and at least to be coupled to the lateral side of the electroluminescence device to seal the electroluminescence device between the first and second barrier layers. An encapsulation method is also presented.

    摘要翻译: 封装结构包括第一阻挡层和被配置为耦合到第一阻挡层并且包括限定侧面的基板和电致发光元件的电致发光器件。 电致发光元件包括设置在基板上的第一电极,第二电极和设置在第一和第二电极之间的有机发光层。 此外,封装结构包括被配置为耦合到电致发光器件的第二阻挡层和被配置为定位在第一和第二阻挡层之间并连接第一和第二势垒层的粘合剂,并且至少要连接到电致发光器件的侧面, 密封第一和第二阻挡层之间的电致发光器件。 还提出了一种封装方法。

    Encapsulation structures of organic electroluminescence devices
    7.
    发明授权
    Encapsulation structures of organic electroluminescence devices 有权
    有机电致发光器件的封装结构

    公开(公告)号:US08350470B2

    公开(公告)日:2013-01-08

    申请号:US12336683

    申请日:2008-12-17

    IPC分类号: H01J1/62 H01J63/04

    摘要: An encapsulation structure comprises a first barrier layer, and an electroluminescence device configured to be coupled to the first barrier layer and comprising a substrate and an electroluminescence element both defining a lateral side. The electroluminescence element comprises a first electrode disposed on the substrate, a second electrode, and an organic light-emitting layer disposed between the first and second electrodes. Further, the encapsulation structure comprises a second barrier layer configured to be coupled to the electroluminescence device, and an adhesive configured to locate between and connect the first and second barrier layers, and at least to be coupled to the lateral side of the electroluminescence device to seal the electroluminescence device between the first and second barrier layers. An encapsulation method is also presented.

    摘要翻译: 封装结构包括第一阻挡层和被配置为耦合到第一阻挡层并且包括限定侧面的基板和电致发光元件的电致发光器件。 电致发光元件包括设置在基板上的第一电极,第二电极和设置在第一和第二电极之间的有机发光层。 此外,封装结构包括被配置为耦合到电致发光器件的第二阻挡层和被配置为定位在第一和第二阻挡层之间并连接第一和第二阻挡层的粘合剂,并且至少要耦合到电致发光器件的侧面, 密封第一和第二阻挡层之间的电致发光器件。 还提出了一种封装方法。

    Encapsulated optoelectronic device and method for making the same
    10.
    发明授权
    Encapsulated optoelectronic device and method for making the same 有权
    封装光电器件及其制造方法

    公开(公告)号:US08102119B2

    公开(公告)日:2012-01-24

    申请号:US12510463

    申请日:2009-07-28

    IPC分类号: H01L51/50

    摘要: An encapsulated optoelectronic device includes: a first barrier layer; an electroluminescence device coupled to the first barrier layer, and comprising a substrate and an electroluminescence element both defining a lateral side, and the electroluminescence element comprising a first electrode disposed on the substrate, a second electrode, and an optoelectronically active layer between the first and second electrodes; a second barrier layer coupled to the electroluminescence device; and an adhesive located between and connecting the first and second barrier layers, and at least coupled to the lateral side of the electroluminescence device to seal the electroluminescence device; a first conductive area electrically coupled to the first electrode and electrically insulated from the second electrode and a second conductive area; the second conductive area electrically coupled to the second electrode and electrically insulated from the first electrode and the first conductive area. A method for making the encapsulated optoelectronic device is presented.

    摘要翻译: 封装的光电器件包括:第一阻挡层; 耦合到所述第一阻挡层的电致发光器件,并且包括限定侧面的衬底和电致发光元件,并且所述电致发光元件包括设置在所述衬底上的第一电极,第二电极和所述第一和第二电极之间的光电活性层, 第二电极; 耦合到所述电致发光器件的第二阻挡层; 以及粘合剂,位于并连接第一和第二阻挡层之间,并且至少耦合到电致发光器件的侧面以密封电致发光器件; 电耦合到第一电极并与第二电极电绝缘的第一导电区域和第二导电区域; 所述第二导电区域电耦合到所述第二电极并且与所述第一电极和所述第一导电区域电绝缘。 提出了一种制造封装光电器件的方法。