Method for isolating flexible film from support substrate
    1.
    发明授权
    Method for isolating flexible film from support substrate 有权
    从支撑基板分离柔性膜的方法

    公开(公告)号:US08883053B2

    公开(公告)日:2014-11-11

    申请号:US12571979

    申请日:2009-10-01

    摘要: Method for isolating a flexible film from a support substrate and method for fabricating an electronic device are provided. The method for isolating a flexible film from a support substrate includes providing a substrate with a top surface. A surface treatment is subjected to the top surface of the substrate, forming a top surface with detachment characteristics. A flexible film is formed on the top surface with detachment characteristics. The flexible film within the top surface with detachment characteristics is cut and isolated.

    摘要翻译: 提供了从支撑基板分离柔性膜的方法和用于制造电子器件的方法。 从支撑衬底分离柔性膜的方法包括提供具有顶表面的衬底。 表面处理受到基板的顶表面的影响,形成具有脱离特性的顶面。 在顶表面上形成具有脱离特性的柔性膜。 切割和隔离具有脱离特性的顶表面内的柔性膜。