摘要:
Method for isolating a flexible film from a support substrate and method for fabricating an electronic device are provided. The method for isolating a flexible film from a support substrate includes providing a substrate with a top surface. A surface treatment is subjected to the top surface of the substrate, forming a top surface with detachment characteristics. A flexible film is formed on the top surface with detachment characteristics. The flexible film within the top surface with detachment characteristics is cut and isolated.
摘要:
A gas barrier substrate including a first gas barrier layer, a substrate, and a second gas barrier layer is provided. The first gas barrier layer has a central bonding surface bonded with the substrate and a peripheral boding surface surrounding the central bonding surface. The second gas barrier layer entirely covers the substrate and the first gas barrier layer. The second gas barrier layer is bonded with the substrate and the peripheral boding surface of the first gas barrier layer, wherein a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.
摘要:
The present invention employs the totally printable process to fabricate an organic/inorganic multi-layered laminate gas barrier film. Such totally printable process is simple with lower costs. Moreover, through the pattern design, the adhesion between the organic and inorganic layers is improved.
摘要:
The present invention employs the totally printable process to fabricate an organic/inorganic multi-layered laminate gas barrier film. Such totally printable process is simple with lower costs. Moreover, through the pattern design, the adhesion between the organic and inorganic layers is improved.