摘要:
An off-line feed rate scheduling method of a CNC machining process includes selecting a constraint variable and inputting a reference value related to the constraint variable; estimating a cutting configuration where a maximum constraint variable value (CVV) occurs through ME Z-map modeling; receiving the estimated cutting configuration and estimating a specific rotation angle (φs) where the maximum constraint variable value occurs through constraint variable modeling; calculating a feed rate that satisfies the reference value of the constraint variable at the estimated specific rotation angle; and applying the calculated feed rate to the NC code. Cutting force or machined surface error may be selected as a constraint variable depending on machining conditions.
摘要:
An off-line feed rate scheduling method of a CNC machining process includes selecting a constraint variable and inputting a reference value related to the constraint variable; estimating a cutting configuration where a maximum constraint variable value (CVV) occurs through ME Z-map modeling; receiving the estimated cutting configuration and estimating a specific rotation angle (φs) where the maximum constraint variable value occurs through constraint variable modeling; calculating a feed rate that satisfies the reference value of the constraint variable at the estimated specific rotation angle; and applying the calculated feed rate to the NC code. Cutting force or machined surface error may be selected as a constraint variable depending on machining conditions.
摘要:
A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing a printed circuit board can include: processing a first hole, which has a tapered shape, in one side of a substrate by using a laser drill; processing a second hole, which has a tapered shape and which connects with the first hole, in the other side of the substrate by using a laser drill in a position corresponding to that of the first hole; and forming a conductive portion, which electrically connects both sides of the substrate through the first hole and the second hole, by performing plating. This method may be used for providing reliable interlayer connections.