摘要:
A semiconductor device including a recessed channel transistor, and a method of manufacturing the same, provide: a substrate in which an isolation trench is provided; an isolation layer provided in the isolation trench so as to define a pair of source/drain regions in the substrate; a gate pattern provided in the isolation trench between the pair of source/drain regions, the gate pattern having a top surface at a same level as a top surface of the isolation layer and having a bottom surface at a lower depth than the pair of source/drain regions with respect to a top surface of the substrate; and a gate insulating layer provided between the substrate and the gate pattern at a bottom surface of the isolation trench.
摘要:
Recessed channel transistor (RCT) devices, methods of manufacturing the RCT devices, and a display apparatuses including the RCT devices. A RCT device includes a substrate, a first trench in the substrate and having a first width; a first gate insulating layer on an inner wall of the first trench; a first recess gate on the first gate insulating layer and having a groove in a center portion of an upper surface of the first recess gate; and a source and drain in the substrate on both sides of the first recess gate.
摘要:
Disclosed is a method of fabricating a semiconductor device having improved processing stability. A protection layer may be formed on a semiconductor substrate. A sacrificial layer having an etch selectivity with respect to the protection layer may be formed on the protection layer. A part of the sacrificial layer may be selectively etched, thereby forming an alignment key. An aligned well may be formed using the alignment key. An aligned isolation layer may be formed in the semiconductor substrate having the well formed therein, using the alignment key.