Matrix-free MALDI mass spectrometry
    2.
    发明授权
    Matrix-free MALDI mass spectrometry 失效
    无基质MALDI质谱

    公开(公告)号:US07675032B2

    公开(公告)日:2010-03-09

    申请号:US11532466

    申请日:2006-09-15

    IPC分类号: B01D59/44 H01J49/00

    CPC分类号: H01J49/0418

    摘要: Particles and monoliths are used for providing an ionized analyte for mass analysis by photon desorption having a size in the range of 0.5-100 μm, wherein the particles or monoliths are modified with a chemical compound capable of absorbing photons having a wave-length of at least 300 nm. The particles and monoliths allow the use of MALDI-MS for the high throughput screening of molecules having a molecular weight lower than 700 μ without interfering signals or with only a limited number of background signals.

    摘要翻译: 颗粒和整料用于提供离子化分析物,用于通过具有0.5-100μm范围内的尺寸的光子解吸进行质量分析,其中颗粒或整料用能够吸收波长为at的光子的化合物修饰 至少300nm。 颗粒和整料允许使用MALDI-MS进行高通量筛选分子量低于700μμ的分子,无干扰信号或只有有限数量的背景信号。

    Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules
    3.
    发明授权
    Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules 失效
    多层陶瓷载体上芯片模块散热的布置,特别是多芯片模块

    公开(公告)号:US06365260B1

    公开(公告)日:2002-04-02

    申请号:US09202112

    申请日:1999-07-08

    IPC分类号: H01L23427

    摘要: A heat dissipation arrangement for chip modules on multilayer ceramic substrates, in particular multichip modules, in which passages for a heat-conducting medium are provided in the ceramic substrate. The multilayer ceramic substrate is mounted on a metal heat sink. Thermal passages, in particular in the form of a hole pattern or array, are provided in the top layer of the multilayer ceramic substrate, in the region of the chip to be mounted. A cavity functioning as an evaporation chamber is provided in the layer of the multilayer ceramic substrate directly beneath the top layer, in the region of the chip to be mounted, and a trough-shaped recess functioning as a condenser is provided in the metal heat sink, in the region of the chip to be mounted. In the layers of the multilayer ceramic substrate located between the evaporation chamber and the condenser, in the region of these two chambers, a series of large steam channels and small condensate channels, the latter functioning as capillaries is provided, which interconnect these two chambers. This arrangement forms a miniaturized heat pipe structure which can transport a great amount of energy per unit of time across short distances.

    摘要翻译: 在多层陶瓷基板,特别是多芯片模块中的芯片模块的散热装置,其中在陶瓷基板中提供用于导热介质的通道。 多层陶瓷基板安装在金属散热器上。 特别是孔图案或阵列形式的热通道在待安装的芯片的区域中设置在多层陶瓷基板的顶层中。 作为蒸发室的空腔设置在多层陶瓷基板的正下方的顶层的下方,在要安装的芯片的区域中,并且用作冷凝器的槽形凹部设置在金属散热器 ,在要安装的芯片的区域。 在位于蒸发室和冷凝器之间的多层陶瓷基板的层中,在这两个室的区域中,提供了一系列大的蒸汽通道和小的冷凝物通道,后者用作毛细管,其连接这两个室。 这种布置形成了一种小型化的热管结构,其可以在短距离内每单位时间输送大量的能量。