公开(公告)号：US06645344B2

公开(公告)日：2003-11-11

申请号：US09861322

申请日：2001-05-18

申请人： Doug Caldwell ,  Albert Garcia, Jr. ,  Thomas J. Horback ,  Michael James Lombardi ,  Mark McNicholas ,  Dean Mize ,  Gon Wang

发明人： Doug Caldwell ,  Albert Garcia, Jr. ,  Thomas J. Horback ,  Michael James Lombardi ,  Mark McNicholas ,  Dean Mize ,  Gon Wang

IPC分类号： H01L2100

CPC分类号： H01L21/68757 ,  H01L21/68785

摘要： A backplane assembly for a substrate processing system that is selectively configurable to provide an effective thermal contact with substrates of differing sizes. The backplane assembly includes a backplane base installed in a vacuum chamber of the substrate processing system and plural faceplates which are removably mountable to the backplane base. The backplane assembly is operable for regulating the temperature of the substrate and include elements that promote the efficient transfer of heat between the backplane base and the faceplate to perform the temperature regulation during processing. Each of the faceplates has a contact surface dimensioned and configured to engage a correspondingly dimensioned and/or configured type of substrate. The faceplates are readily demountable from the backplane base for exchange to accommodate a change in the dimension and/or configuration of the substrates being processed by the substrate processing system without removing the backplane base from the vacuum chamber.