公开(公告)号：US09434044B2

公开(公告)日：2016-09-06

申请号：US14668866

申请日：2015-03-25

申请人： EBARA CORPORATION

发明人： Ryuichi Kosuge ,  Hiroshi Sotozaki ,  Takahiro Kawano ,  Akihiro Mochida

IPC分类号： B24B37/00 ,  B24B37/005

CPC分类号： B24B37/0053

摘要： A polishing apparatus which can reduce scratches that are generated on a surface of a substrate during polishing by detecting a foreign matter such as a fragment of the substrate on an inner circumferential surface of a retaining ring for holding an edge portion (peripheral portion) of the substrate is disclosed. The polishing apparatus includes a polishing table having a polishing surface, and a top ring having a substrate holding surface to hold a beck surface of a substrate and a retaining ring to retain the substrate on the substrate holding surface. The top ring holds the substrate and presses the substrate against the polishing surface. The polishing apparatus includes an imaging device configured to image an inner circumferential surface of the retaining ring, and an image processor configured to process an image obtained by the imaging device to judge whether there is a foreign matter on the inner circumferential surface of the retaining ring.

摘要翻译： 一种抛光装置，其能够通过在保持环的保持环的内周面上检测诸如基片的碎片等异物来保持边缘部（周边部），从而能够减少在研磨时在基板表面产生的划痕 底物被公开。 抛光装置包括具有抛光表面的抛光台和具有用于保持基板的表面的基板保持表面和保持环以将基板保持在基板保持表面上的顶环。 顶环保持基板并将基板压靠在抛光表面上。 抛光装置包括：成像装置，其被构造成对保持环的内周面进行成像;以及图像处理器，被配置为处理由成像装置获得的图像，以判断在保持环的内周面上是否存在异物 。