公开(公告)号：US20170252889A1

公开(公告)日：2017-09-07

申请号：US15599919

申请日：2017-05-19

Applicant: EBARA CORPORATION

Inventor： Katsuhide WATANABE ,  Masakazu IHARA

IPC: B24B37/005 ,  B24B49/16 ,  B24B37/10 ,  B24B49/18

CPC classification number: B24B37/005 ,  B24B37/107 ,  B24B49/16 ,  B24B49/18

Abstract: A polishing apparatus includes a table rotating motor configured to rotate a polishing table about its own axis, a top ring rotating motor configured to rotate a top ring about its own axis, a dresser configured to dress a polishing pad, and a pad-height measuring device configured to measure a height of the polishing pad. The polishing apparatus also includes a diagnostic device configured to calculate an amount of wear of the polishing pad from the height of the polishing pad and to determine the end of a life of the polishing pad based on the amount of the wear of the polishing pad, the torque or current of the table rotating motor, and the torque or current of the top ring rotating motor.