公开(公告)号：US20220063056A1

公开(公告)日：2022-03-03

申请号：US17410099

申请日：2021-08-24

Applicant: EBARA CORPORATION

Inventor： Atsushi ABE ,  Taro TAKAHASHI ,  Hiroaki SHIBUE ,  Shinpei TOKUNAGA ,  Katsuhide WATANABE

IPC: B24B49/10 ,  G01B7/06

Abstract: An eddy current sensor has an exciting coil and a detection coil. A holding circuit holds reference data indicating a characteristic of an output signal output from the detection coil at a reference state and outputs the reference data at a state other than the reference state. A pseudo signal generating circuit generates and outputs a balance coil pseudo signal corresponding to the output signal output from the detection coil at the reference state from the reference data output from the holding circuit. A bridge circuit, at the state other than the reference state, receives the output signal output from the detection coil and the balance coil pseudo signal and outputs a bridge output signal corresponding to a difference between the output signal and the balance coil pseudo signal as a bridge output signal.

公开(公告)号：US20200223027A1

公开(公告)日：2020-07-16

申请号：US16715403

申请日：2019-12-16

Applicant: Ebara Corporation

Inventor： Katsuhide WATANABE ,  Itsuki KOBATA

IPC: B24B37/005 ,  H01L21/67 ,  H01L21/02 ,  B24B57/02

Abstract: To quickly grasp a film thickness distribution of a film to be processed on a substrate after CMP and realize high-speed substrate processing, an embodiment of the present invention provides a method for specifying an area to be partially polished by a partial polishing device in a substrate processing apparatus. The substrate processing apparatus includes a substrate polishing device that polishes an entire surface of a film to be processed formed on at least one surface of the substrate. The substrate polishing device includes a film thickness sensor. The substrate processing apparatus further includes the partial polishing device that further partially polishes the film to be processed of the substrate polished by the substrate polishing device. The method includes specifying an area to be partially polished by the partial polishing device based on film thickness distribution data of the film to be processed obtained from the film thickness sensor of the substrate polishing device.

公开(公告)号：US20150093971A1

公开(公告)日：2015-04-02

申请号：US14563383

申请日：2014-12-08

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Katsuhide WATANABE ,  Hozumi YASUDA ,  Satoru YAMAKI

IPC: B24B37/10 ,  H01L21/683 ,  H01L21/67

CPC classification number: B24B37/005 ,  B24B37/015 ,  B24B37/10 ,  B24B37/30 ,  H01L21/67017 ,  H01L21/67092 ,  H01L21/6838

Abstract: A polishing is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to forma substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector.

Abstract translation: 抛光用于将诸如半导体晶片的基板抛光到平面镜面。 抛光装置包括具有抛光表面的抛光台，配置成保持基板并将基板压靠在抛光表面上的基板保持装置和控制器。 基板保持装置包括：弹性膜，其构成为形成与基板接触的基板保持面，设置在弹性膜上方的载体，形成在弹性膜与载体之间的至少一个压力室，以及红外光检测器 被配置为测量来自弹性膜的热能。 控制器使用红外光检测器的测量值来计算弹性膜的温度的估计值。

公开(公告)号：US20150111314A1

公开(公告)日：2015-04-23

申请号：US14589988

申请日：2015-01-05

Applicant: EBARA CORPORATION

Inventor： Takeshi IIZUMI ,  Katsuhide WATANABE ,  Yoichi KOBAYASHI

IPC: H01L21/321 ,  B24B49/12 ,  H01L21/67 ,  B24B37/013 ,  H01L21/66 ,  H01L21/3105

CPC classification number: H01L21/3212 ,  B24B37/013 ,  B24B37/042 ,  B24B49/12 ,  G01B7/105 ,  G01B11/0625 ,  G01B11/0683 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/31055 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253 ,  H01L21/76224 ,  H01L21/76819 ,  H01L21/7684 ,  H01L22/12 ,  H01L22/20

Abstract: A method of polishing a substrate having a film is provided. The method includes: performing polishing of the substrate in a polishing section; transporting the polished substrate to a wet-type film thickness measuring device prior to cleaning and drying of the substrate; measuring a thickness of the film by the wet-type film thickness measuring device; comparing the thickness with a predetermined target value; and if the thickness has not reached the predetermined target value, performing re-polishing of the substrate in the polishing section prior to cleaning and drying of the substrate.

Abstract translation: 提供了抛光具有膜的基板的方法。 该方法包括：对抛光部分中的基板进行抛光; 在清洗和干燥基板之前将抛光的基板运送到湿式膜厚测量装置; 通过湿式膜厚测量装置测量膜的厚度; 将厚度与预定目标值进行比较; 并且如果厚度未达到预定目标值，则在清洁和干燥基板之前对抛光部分中的基板进行再抛光。

公开(公告)号：US20140017824A1

公开(公告)日：2014-01-16

申请号：US13938018

申请日：2013-07-09

Applicant: EBARA CORPORATION

Inventor： Takeshi IIZUMI ,  Katsuhide WATANABE ,  Yoichi KOBAYASHI

IPC: H01L21/306

CPC classification number: H01L21/3212 ,  B24B37/013 ,  B24B37/042 ,  B24B49/12 ,  G01B7/105 ,  G01B11/0625 ,  G01B11/0683 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/31055 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253 ,  H01L21/76224 ,  H01L21/76819 ,  H01L21/7684 ,  H01L22/12 ,  H01L22/20

Abstract: A method of polishing a substrate having a film is provided. The method includes: performing polishing of the substrate in a polishing section; transporting the polished substrate to a wet-type film thickness measuring device prior to cleaning and drying of the substrate; measuring a thickness of the film by the wet-type film thickness measuring device; comparing the thickness with a predetermined target value; and if the thickness has not reached the predetermined target value, performing re-polishing of the substrate in the polishing section prior to cleaning and drying of the substrate.

Abstract translation: 提供了抛光具有膜的基板的方法。 该方法包括：对抛光部分中的基板进行抛光; 在清洗和干燥基板之前将抛光的基板运送到湿式膜厚测量装置; 通过湿式膜厚测量装置测量膜的厚度; 将厚度与预定目标值进行比较; 并且如果厚度未达到预定目标值，则在清洁和干燥基板之前对抛光部分中的基板进行再抛光。

公开(公告)号：US20210166967A1

公开(公告)日：2021-06-03

申请号：US16616549

申请日：2018-05-02

Applicant: EBARA CORPORATION

Inventor： Akira FUKUNAGA ,  Katsuhide WATANABE ,  Itsuki KOBATA ,  Manabu TSUJIMURA

IPC: H01L21/768 ,  H01L21/321 ,  H01L21/66 ,  B24B37/04 ,  B24B37/005 ,  B24B37/015

Abstract: To planarize a substrate having irregularities on its surface. Provided is a method of chemical mechanical polishing of a substrate. The method includes the step of polishing the substrate using a processing solution, and the step of changing concentration of an effective component in the processing solution, which contributes to the polishing of the substrate.

公开(公告)号：US20190193242A1

公开(公告)日：2019-06-27

申请号：US16230614

申请日：2018-12-21

Applicant: EBARA CORPORATION

Inventor： Taro TAKAHASHI ,  Hiroaki SHIBUE ,  Katsuhide WATANABE

IPC: B24B49/10 ,  B24B49/12 ,  B24B49/16 ,  B24B37/013 ,  G01N27/90

CPC classification number: B24B49/105 ,  B24B37/013 ,  B24B49/12 ,  B24B49/16 ,  G01N27/90

Abstract: A magnetic element for strengthening a magnetic field formed in an object and an eddy current sensor using the magnetic field are provided. The eddy current sensor includes a bottom face portion which is a magnetic body, a magnetic core portion provided at the middle of the bottom face portion and a peripheral wall portion provided on the periphery of the bottom face portion. The eddy current sensor further includes an excitation coil disposed on an outer periphery of the magnetic core portion and capable of generating a magnetic field and an excitation coil disposed on an outer periphery of the peripheral wall portion and capable of generating a magnetic field.

公开(公告)号：US20170259395A1

公开(公告)日：2017-09-14

申请号：US15453442

申请日：2017-03-08

Applicant: Ebara Corporation

Inventor： Itsuki KOBATA ,  Katsuhide WATANABE ,  Hozumi YASUDA ,  Yuji YAGI ,  Nobuyuki TAKAHASHI ,  Koichi TAKEDA

IPC: B24B37/013 ,  B24B37/20 ,  B24B37/04

CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B37/20

Abstract: One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises: a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.

公开(公告)号：US20170252889A1

公开(公告)日：2017-09-07

申请号：US15599919

申请日：2017-05-19

Applicant: EBARA CORPORATION

Inventor： Katsuhide WATANABE ,  Masakazu IHARA

IPC: B24B37/005 ,  B24B49/16 ,  B24B37/10 ,  B24B49/18

CPC classification number: B24B37/005 ,  B24B37/107 ,  B24B49/16 ,  B24B49/18

Abstract: A polishing apparatus includes a table rotating motor configured to rotate a polishing table about its own axis, a top ring rotating motor configured to rotate a top ring about its own axis, a dresser configured to dress a polishing pad, and a pad-height measuring device configured to measure a height of the polishing pad. The polishing apparatus also includes a diagnostic device configured to calculate an amount of wear of the polishing pad from the height of the polishing pad and to determine the end of a life of the polishing pad based on the amount of the wear of the polishing pad, the torque or current of the table rotating motor, and the torque or current of the top ring rotating motor.

公开(公告)号：US20140287653A1

公开(公告)日：2014-09-25

申请号：US14187150

申请日：2014-02-21

Applicant: EBARA CORPORATION

Inventor： Takahiro SHIMANO ,  Mutsumi TANIKAWA ,  Hisanori MATSUO ,  Kuniaki YAMAGUCHI ,  Katsuhide WATANABE

IPC: B24B53/017 ,  B24B37/005

CPC classification number: B24B53/017 ,  B24B37/005

Abstract: The method includes the steps of measuring a surface height of a polishing member 10 at each of plural oscillation sections Z1 to Z5 which are defined in advance on the polishing member 10 along an oscillation direction of a dresser 5; calculating a difference between a current profile obtained from measured values of the surface height and a target profile of the polishing member 10; and correcting moving speeds of the dresser 5 in the plural oscillation sections Z1 to Z5 so as to eliminate the difference.

Abstract translation: 该方法包括以下步骤：沿着修整器5的摆动方向在研磨部件10上预先确定的多个振动部Z1〜Z5的每一个上测量研磨部件10的表面高度; 计算从抛光构件10的表面高度和目标轮廓的测量值获得的电流曲线之间的差; 并修正多个振荡部Z1〜Z5中的修整器5的移动速度，以消除差异。