公开(公告)号：US12179312B2

公开(公告)日：2024-12-31

申请号：US17193049

申请日：2021-03-05

Applicant: EBARA CORPORATION

Inventor： Takuya Moriura ,  Hiroshi Sotozaki ,  Tadakazu Sone ,  Masayoshi Ito ,  Itsuki Kobata ,  Hisanori Matsuo ,  Tetsuya Terada

IPC: B24B57/02 ,  B24B37/04

Abstract: There is provided an apparatus for polishing, comprising a table configured to support a polishing pad; a polishing head configured to hold a substrate; and a polishing solution supply device configured to supply a polishing solution between the polishing pad and the substrate. The polishing solution supply device comprises a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the substrate. The polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution.