公开(公告)号：US20240001407A1

公开(公告)日：2024-01-04

申请号：US18036342

申请日：2021-10-25

Applicant: EBARA CORPORATION

Inventor： Asagi MATSUGU ,  Akihiro YAZAWA ,  Manato FURUSAWA ,  Hideharu AOYAMA ,  Ayumu SAITO ,  Yusuke SASAYA ,  Kenichi KOBAYASHI ,  Yasuyuki MIYASAWA ,  Tsuyoshi SOMA ,  Keiichi NOJO

IPC: B08B1/02 ,  B08B3/12 ,  B24B37/34

CPC classification number: B08B1/02 ,  B08B3/12 ,  B24B37/34

Abstract: To achieve a cleaning module and a substrate processing apparatus that can improve the cleaning capability for a substrate with a simple structure.
A cleaning module includes a first transfer mechanism 210-1, an ultrasonic cleaning tank 440, a transfer machine 420, and a second transfer mechanism 210-2. The first transfer mechanism 210-1 is for transferring a substrate WF with a surface to be polished facing downward up to a substrate grip or release position 418 on a downstream side along a transfer passage 405. The ultrasonic cleaning tank 440 is disposed at a position spaced apart from the transfer passage 405 and is for cleaning a substrate WF with the surface to be polished facing downward. The transfer machine 420 is for transferring the substrate WF between the substrate grip or release position 418 of the transfer passage 405 and the ultrasonic cleaning tank 440. The second transfer mechanism 210-2 is for transferring the substrate WF transferred to the substrate grip or release position 418 from the ultrasonic cleaning tank 440 by the transfer machine 420 to further downstream along the transfer passage 405.