公开(公告)号：US20210187692A1

公开(公告)日：2021-06-24

申请号：US17117723

申请日：2020-12-10

Applicant: EBARA CORPORATION

Inventor： Akihiro YAZAWA ,  Kenichi KOBAYASHI ,  Asagi MATSUGU

IPC: B24B37/005 ,  B24B37/04 ,  B24B49/12

Abstract: An accuracy of detecting a slip out of a substrate from a top ring is improved. A polishing unit 300 includes a polishing table 350, a top ring 302, a light emitting member 371, a slip-out detector 370, and an elimination mechanism 380. A polishing pad 352 that polishes a substrate WF is attached to the polishing table 350. The top ring 302 holds the substrate WF to press the substrate WF against the polishing pad 352. The light emitting member 371 emits a light to a detection area 372 on the polishing pad 352. The slip-out detector 370 detects a slip out of the substrate WF from the top ring 302 based on the light reflected from the detection area 372. The elimination mechanism 380 eliminates a polishing liquid flowing into the detection area 372.

公开(公告)号：US20190214278A1

公开(公告)日：2019-07-11

申请号：US16236024

申请日：2018-12-28

Applicant: EBARA CORPORATION

Inventor： Toshio YOKOYAMA ,  Masahiko SEKIMOTO ,  Kenichi KOBAYASHI

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677

Abstract: A substrate attaching/detaching unit includes a stocker accommodating a plurality of substrate holders 80 and adapted so that the substrate holders 80 are aligned in a vertical direction with one another in a horizontal posture, a first substrate holder conveying mechanism that takes the substrate holders 80 into and out of the stocker, an elevating mechanism that raises and lowers the first substrate holder conveying mechanism in the vertical direction, a second substrate holder conveying mechanism that transfers the substrate holder to and from the first substrate holder conveying mechanism, and a substrate attaching/detaching mechanism that attaches and detaches the substrate to and from the substrate holder held in the second substrate holder conveying mechanism.

公开(公告)号：US20150357213A1

公开(公告)日：2015-12-10

申请号：US14734983

申请日：2015-06-09

Applicant: EBARA CORPORATION

Inventor： Toshio YOKOYAMA ,  Masahiko SEKIMOTO ,  Kenichi KOBAYASHI

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/02 ,  H01L21/687 ,  H01L21/311 ,  B25J11/00 ,  H01L21/68

CPC classification number: H01L21/67086 ,  H01L21/67718 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/68707 ,  H01L21/68721

Abstract: A substrate attaching/detaching unit includes a stocker accommodating a plurality of substrate holders 80 and adapted so that the substrate holders 80 are aligned in a vertical direction with one another in a horizontal posture, a first substrate holder conveying mechanism that takes the substrate holders 80 into and out of the stocker, an elevating mechanism that raises and lowers the first substrate holder conveying mechanism in the vertical direction, a second substrate holder conveying mechanism that transfers the substrate holder to and from the first substrate holder conveying mechanism, and a substrate attaching/detaching mechanism that attaches and detaches the substrate to and from the substrate holder held in the second substrate holder conveying mechanism.

Abstract translation: 基板安装/拆卸单元包括容纳多个基板保持件80的储料器，并且适于使基板保持件80在垂直方向上以水平姿势彼此对准;第一基板保持器输送机构，其将基板保持件80 进出储存器的方法，是使第一基板保持架输送机构沿垂直方向升高并降低的升降机构，将基板保持件向第一基板保持架输送机构转移的第二基板保持架输送机构， /分离机构，其将基板附接到保持在第二基板保持架输送机构中的基板保持件和从基板保持器分离。

公开(公告)号：US20150270147A1

公开(公告)日：2015-09-24

申请号：US14666215

申请日：2015-03-23

Applicant: EBARA CORPORATION

Inventor： Kenichi KOBAYASHI ,  Masahiko SEKIMOTO ,  Toshio YOKOYAMA ,  Kenichi AKAZAWA ,  Keiichi KURASHINA ,  Takashi MITSUYA

IPC: H01L21/67 ,  B25J11/00 ,  H01L21/687

CPC classification number: H01L21/67057 ,  B25J11/0095 ,  H01L21/67034 ,  H01L21/67173 ,  H01L21/67276 ,  H01L21/68721 ,  H01L21/68742

Abstract: A substrate processing apparatus capable of inhibiting diffusion of a chemical solution atmosphere around a processing bath. The substrate processing apparatus has a processing bath for storing a substrate holder holding a substrate and for processing the substrate, a lifter configured to support the substrate holder, store the substrate holder in the processing bath, and take out the substrate holder from the processing bath, and a cover configured to cover the periphery of the substrate holder taken out from the processing bath by the lifter.

Abstract translation: 能够抑制处理槽周围的化学溶液气氛扩散的基板处理装置。 基板处理装置具有用于存储保持基板并用于处理基板的基板保持件的处理槽，构造成支撑基板保持器的升降器，将基板保持器存储在处理槽中，并从处理槽取出基板保持件 以及盖，其构造成覆盖由所述升降机从所述处理槽取出的所述基板保持器的周边。

公开(公告)号：US20150050863A1

公开(公告)日：2015-02-19

申请号：US14530589

申请日：2014-10-31

Applicant: EBARA CORPORATION

Inventor： Mitsuru MIYAZAKI ,  Seiji KATSUOKA ,  Naoki MATSUDA ,  Junji KUNISAWA ,  Kenichi KOBAYASHI ,  Hiroshi SOTOZAKI ,  Hiroyuki SHINOZAKI ,  Osamu NABEYA ,  Shinya MORISAWA ,  Takahiro OGAWA ,  Natsuki MAKINO

IPC: B24B37/34 ,  H01L21/677 ,  H01L21/67

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

Abstract translation: 公开了一种用于处理衬底的设备。 该装置包括：抛光部，其被配置为对基板进行抛光;移动机构，被配置为传送基板;以及清洁部，其构造成清洁和干燥被抛光的基板。 清洗部具有多个用于清洗多个基板的清洗线。 多个清洁线具有多个清洁模块和用于传送基板的多个传送机器人。

公开(公告)号：US20240091899A1

公开(公告)日：2024-03-21

申请号：US18521813

申请日：2023-11-28

Applicant: EBARA CORPORATION

Inventor： Kenichi KOBAYASHI ,  Masayuki NAKANISHI ,  Makoto KASHIWAGI ,  Manao HOSHINA

IPC: B24B37/04 ,  B24B7/22 ,  B24B21/00 ,  B24B21/10 ,  B24B37/005 ,  B24B37/10 ,  B24B37/30 ,  B24B41/06 ,  H01L21/02 ,  H01L21/67 ,  H01L21/687

CPC classification number: B24B37/042 ,  B24B7/228 ,  B24B21/004 ,  B24B21/008 ,  B24B21/10 ,  B24B37/005 ,  B24B37/105 ,  B24B37/30 ,  B24B41/067 ,  H01L21/0209 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/68728 ,  H01L21/68742 ,  H01L21/68764

Abstract: A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.

公开(公告)号：US20240001407A1

公开(公告)日：2024-01-04

申请号：US18036342

申请日：2021-10-25

Applicant: EBARA CORPORATION

Inventor： Asagi MATSUGU ,  Akihiro YAZAWA ,  Manato FURUSAWA ,  Hideharu AOYAMA ,  Ayumu SAITO ,  Yusuke SASAYA ,  Kenichi KOBAYASHI ,  Yasuyuki MIYASAWA ,  Tsuyoshi SOMA ,  Keiichi NOJO

IPC: B08B1/02 ,  B08B3/12 ,  B24B37/34

CPC classification number: B08B1/02 ,  B08B3/12 ,  B24B37/34

Abstract: To achieve a cleaning module and a substrate processing apparatus that can improve the cleaning capability for a substrate with a simple structure.
A cleaning module includes a first transfer mechanism 210-1, an ultrasonic cleaning tank 440, a transfer machine 420, and a second transfer mechanism 210-2. The first transfer mechanism 210-1 is for transferring a substrate WF with a surface to be polished facing downward up to a substrate grip or release position 418 on a downstream side along a transfer passage 405. The ultrasonic cleaning tank 440 is disposed at a position spaced apart from the transfer passage 405 and is for cleaning a substrate WF with the surface to be polished facing downward. The transfer machine 420 is for transferring the substrate WF between the substrate grip or release position 418 of the transfer passage 405 and the ultrasonic cleaning tank 440. The second transfer mechanism 210-2 is for transferring the substrate WF transferred to the substrate grip or release position 418 from the ultrasonic cleaning tank 440 by the transfer machine 420 to further downstream along the transfer passage 405.

公开(公告)号：US20170151646A1

公开(公告)日：2017-06-01

申请号：US15353913

申请日：2016-11-17

Applicant: Ebara Corporation

Inventor： Akihiro YAZAWA ,  Kenichi KOBAYASHI

IPC: B24B37/005 ,  B24B9/06

CPC classification number: B24B37/005 ,  B24B9/065

Abstract: An object of the invention is to provide a calibration apparatus which enables the pressing force of the polishing pad to be adjusted by a simple method without the need of removing a stage on which a substrate can be placed.One embodiment of the invention provides a calibration apparatus for a bevel polishing system for polishing a bevel portion of a substrate, comprising: a load measuring device capable of measuring a pressing load from a polishing pad of the bevel polishing system; and a base plate capable of having the load measuring device placed thereon, wherein the base plate is capable of being fixed on a vacuum suction table which is capable of having a substrate placed thereon.

公开(公告)号：US20140302676A1

公开(公告)日：2014-10-09

申请号：US14309152

申请日：2014-06-19

Applicant: Ebara Corporation

Inventor： Mitsuru MIYAZAKI ,  Seiji KATSUOKA ,  Naoki MATSUDA ,  Junji KUNISAWA ,  Kenichi KOBAYASHI ,  Hiroshi SOTOZAKI ,  Hiroyuki SHINOZAKI ,  Osamu NABEYA ,  Shinya MORISAWA ,  Takahiro OGAWA ,  Natsuki MAKINO

IPC: H01L21/67 ,  H01L21/306

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

Abstract translation: 公开了一种用于处理衬底的设备。 该装置包括：抛光部，其被配置为对基板进行抛光;移动机构，被配置为传送基板;以及清洁部，其构造成清洁和干燥被研磨的基板。 清洗部具有多个用于清洗多个基板的清洗线。 多个清洁线具有多个清洁模块和用于传送基板的多个传送机器人。

公开(公告)号：US20140120725A1

公开(公告)日：2014-05-01

申请号：US14061673

申请日：2013-10-23

Applicant: EBARA CORPORATION

Inventor： Mitsuru MIYAZAKI ,  Kenichi KOBAYASHI ,  Teruaki HOMBO ,  Akira IMAMURA ,  Boyu DONG ,  Hiroyuki SHINOZAKI

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/306

CPC classification number: H01L21/30625 ,  B24B37/30 ,  B24B37/34 ,  B24B37/345 ,  H01L21/67051 ,  H01L21/67219

Abstract: A polishing apparatus is used for polishing a surface of a substrate such as a semiconductor wafer to planarize the surface of the substrate. The polishing apparatus includes a polishing table having a polishing surface, and a top ring configured to hold a substrate with an outer circumferential edge of the substrate surrounded by a retainer ring and to press the substrate against the polishing surface. The top ring is movable between a polishing position above the polishing table, a position laterally of the polishing table, and a cleaning position. The polishing apparatus includes a cleaning unit disposed in the cleaning position and configured to eject a cleaning liquid toward the lower surface of the top ring, which is being rotated, thereby cleaning the substrate held by the top ring together with the lower surface of the top ring.

Abstract translation: 抛光装置用于抛光诸如半导体晶片的基板的表面以平坦化基板的表面。 抛光装置包括具有抛光表面的抛光台，以及顶环，其构造成保持基板的外周边缘由保持环包围并将基板压靠在抛光表面上。 顶环可在抛光台上方的抛光位置，抛光台侧面的位置和清洁位置之间移动。 抛光装置包括清洁单元，该清洁单元设置在清洁位置并且被配置为朝着正在旋转的顶环的下表面喷射清洁液体，由此清洁由顶环保持的基板与顶部的下表面 环。