公开(公告)号：US10207390B2

公开(公告)日：2019-02-19

申请号：US14017620

申请日：2013-09-04

申请人： EBARA CORPORATION ,  Toshiba Memory Corporation

发明人： Noburu Shimizu ,  Shinro Ohta ,  Koji Maruyama ,  Yoichi Kobayashi ,  Ryuichiro Mitani ,  Shunsuke Nakai ,  Atsushi Shigeta

IPC分类号： B24B49/04 ,  B24B37/013 ,  B24D7/12 ,  G01N21/55 ,  G05B19/40 ,  B24B49/12 ,  G01N21/95 ,  H01L21/66 ,  G05B19/406 ,  B24B49/16 ,  G01B11/06 ,  G05B19/4065

摘要： A processing end point detection method detects a timing of a processing end point (e.g., polishing stop, changing of polishing conditions) by calculating a characteristic value of a surface of a workpiece (an object of polishing) such as a substrate. This method includes producing a spectral waveform indicating a relationship between reflection intensities and wavelengths at a processing end point, with use of a reference workpiece or simulation calculation, based on the spectral waveform, selecting wavelengths of a local maximum value and a local minimum value of the reflection intensities, calculating the characteristic value with respect to a surface, to be processed, from reflection intensities at the selected wavelengths, setting a distinctive point of time variation of the characteristic value at a processing end point of the workpiece as the processing end point, and detecting the processing end point of the workpiece by detecting the distinctive point during processing of the workpiece.