公开(公告)号：US20220168847A1

公开(公告)日：2022-06-02

申请号：US17599756

申请日：2020-05-29

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Jan KLEINERT ,  Zhibin LIN ,  Joel SCHRAUBEN ,  Mark UNRATH ,  Honghua HU ,  Ruolin CHEN ,  Chuan YANG ,  Geoffrey LOTT ,  Daragh FINN

IPC: B23K26/362 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/06 ,  G02F1/33

Abstract: Numerous embodiments are disclosed. Many of which relate to methods of forming vias in workpieces such as printed circuit boards. Some embodiments relates techniques for indirectly ablating a region of an electrical conductor structure of, for example, a printed circuit board by spatially distributing laser energy throughout the region before the electrical conductor is indirectly ablated. Other embodiments relate to techniques for temporally-dividing laser pulses, modulating the optical power within laser pulses, and the like.