公开(公告)号：US20220168847A1

公开(公告)日：2022-06-02

申请号：US17599756

申请日：2020-05-29

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Jan KLEINERT ,  Zhibin LIN ,  Joel SCHRAUBEN ,  Mark UNRATH ,  Honghua HU ,  Ruolin CHEN ,  Chuan YANG ,  Geoffrey LOTT ,  Daragh FINN

IPC: B23K26/362 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/06 ,  G02F1/33

Abstract: Numerous embodiments are disclosed. Many of which relate to methods of forming vias in workpieces such as printed circuit boards. Some embodiments relates techniques for indirectly ablating a region of an electrical conductor structure of, for example, a printed circuit board by spatially distributing laser energy throughout the region before the electrical conductor is indirectly ablated. Other embodiments relate to techniques for temporally-dividing laser pulses, modulating the optical power within laser pulses, and the like.

公开(公告)号：US20150050468A1

公开(公告)日：2015-02-19

申请号：US14461171

申请日：2014-08-15

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Robert REICHENBACH ,  Chuan YANG ,  Fang SHAN

IPC: B41J2/455

CPC classification number: B23K26/0624 ,  B23K26/0006 ,  B23K26/082 ,  B23K26/0823 ,  B23K26/083 ,  B23K26/0853 ,  B23K26/0869 ,  B23K26/0876 ,  B23K26/53 ,  B23K26/57 ,  B23K2101/007 ,  B23K2101/34 ,  B23K2101/40 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/14 ,  B23K2103/15 ,  B23K2103/56 ,  Y10T428/24802

Abstract: Laser output (114) is employed to mark an article (100) including a layer (104) supported by a substrate (102), wherein the layer (104) has a thickness (t) that is less than or equal to 50 microns. The laser output (114) is focused to a numerical aperture diffraction-limited spot size (32) of less than or equal to 5 microns at a focal point (80) of the beam waist (90) and directed into the layer (104) to form a plurality of structures comprising a plurality of laser-induced cracks within the layer (104) and within a region of the article (100), wherein the laser-induced cracks terminate within the layer (104) without extending to the substrate (102) or an outer surface (108) of the layer (104), and wherein the plurality of structures are configured to scatter light incident upon the article (100).

Abstract translation: 激光输出（114）用于标记包括由衬底（102）支撑的层（104）的制品（100），其中该层（104）的厚度（t）小于或等于50微米。 在束腰（90）的焦点（80）处将激光输出（114）聚焦到小于或等于5微米的数值孔径衍射限制光斑尺寸（32）并被引导到层（104）中， 以形成多个结构，其包括在所述层（104）内并且在所述制品（100）的区域内的多个激光诱发的裂纹，其中所述激光诱发的裂纹终止于所述层（104）内而不延伸到所述衬底 102）或所述层（104）的外表面（108），并且其中所述多个结构被配置为散射入射在所述物品（100）上的光。