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1.发明公开公开(公告)号：US20240001484A1
公开(公告)日：2024-01-04
申请号：US18345053
申请日：2023-06-30
IPC分类号： B23K26/03 , B23K26/082 , B23K26/06 , B23K26/40 , B23K26/046 , B23K26/08
CPC分类号： B23K26/032 , B23K26/082 , B23K26/0648 , B23K2103/50 , B23K26/40 , B23K26/046 , B23K26/08 , B23K26/0665
摘要： A method includes receiving, during a period of time, a continuous wave laser beam at an acousto-optic deflector (AOD) having a first AOD and a second AOD. A plurality of laser pulses is generated from the received beam using the first acousto-optic deflector (AOD) to the laser beam along a first axis and using the second AOD to deflect the laser beam deflected by the first AOD along a second axis.
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2.发明公开公开(公告)号：US20240293897A1
公开(公告)日：2024-09-05
申请号：US18663649
申请日：2024-05-14
发明人： Patrick RIECHEL , Mark UNRATH , Jake ROBERTS , Joseph HASTY
IPC分类号： B23K26/70 , B23K26/03 , B23K26/067 , B23K26/08 , B23K26/082 , B65H18/10 , G02B27/10 , G02F1/33
CPC分类号： B23K26/705 , B23K26/032 , B23K26/067 , B23K26/082 , B23K26/083 , B65H18/103 , G02B27/108 , G02F1/33
摘要： Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to use of beam characterization tools to facilitate adaptive processing, process control and other desirable features. Other embodiments relate to laser power sensors incorporating integrating spheres. Still other embodiments relate to workpiece handling systems capable of simultaneously providing different workpieces to a common laser-processing apparatus. A great number of other embodiments and arrangements are also detailed.
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3.发明公开公开(公告)号：US20240017350A1
公开(公告)日：2024-01-18
申请号：US18253838
申请日：2021-11-23
发明人： Jan KLEINERT , Ruolin CHEN , James BROOKHYSER , Mark UNRATH , Honghua HU
IPC分类号： B23K26/0622 , B23K26/03
CPC分类号： B23K26/0622 , B23K26/03 , B23K2101/42
摘要： A laser-processing apparatus can carry out a process to form a via in a workpiece, having a first material formed on a second material, by directing laser energy onto the workpiece such that the laser energy is incident upon the first material, wherein the laser energy has a wavelength to which the first material is more reflective than the second material. The apparatus can include a back-reflection sensing system operative to capture a back-reflection signal corresponding to a portion of laser energy directed to the workpiece and reflected by the first material and generate a sensor signal based on the captured back-reflection signal; and a controller communicatively coupled to an output of the back-reflection sensing system, wherein the controller is operative to control a remainder of the process by which the via is formed based on the sensor signal.
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公开(公告)号：US20230390866A1
公开(公告)日：2023-12-07
申请号：US18252059
申请日：2021-11-23
发明人： James BROOKHYSER , Jan KLEINERT , Jered RICHTER , Mark UNRATH
IPC分类号： B23K26/082 , B23K26/06
CPC分类号： B23K26/0821 , B23K26/0648 , B23K26/0676 , B23K26/0643 , B23K26/0665
摘要： Numerous embodiments of optical relay systems are disclosed. In one embodiment, a laser-processing apparatus includes an optical relay system configured to correct for beam placement errors by maintaining the optical path length of a beam of laser energy between a first positioner and a scan lens. In another embodiment, the optical relay system may include a first lens, a second lens, and a zoom lens assembly arranged between the first lens and the second lens, wherein the zoom lens assembly includes a first lens group and a second lens group. The zoom lens assembly may be movable relative to the first lens and the second lens (e.g., mounted on a positioner, such as a motion stage). The distance between the lenses of the first lens group and the distance between the lenses of the second lens group may be fixed or variable.
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公开(公告)号：US20220168847A1
公开(公告)日：2022-06-02
申请号：US17599756
申请日：2020-05-29
发明人： Jan KLEINERT , Zhibin LIN , Joel SCHRAUBEN , Mark UNRATH , Honghua HU , Ruolin CHEN , Chuan YANG , Geoffrey LOTT , Daragh FINN
IPC分类号： B23K26/362 , B23K26/0622 , B23K26/082 , B23K26/06 , G02F1/33
摘要： Numerous embodiments are disclosed. Many of which relate to methods of forming vias in workpieces such as printed circuit boards. Some embodiments relates techniques for indirectly ablating a region of an electrical conductor structure of, for example, a printed circuit board by spatially distributing laser energy throughout the region before the electrical conductor is indirectly ablated. Other embodiments relate to techniques for temporally-dividing laser pulses, modulating the optical power within laser pulses, and the like.
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