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公开(公告)号：US20230067645A1
公开(公告)日：2023-03-02
申请号：US17851148
申请日：2022-06-28
Inventor： Hae Chung KANG , Eun Kyu KANG , Jong Jin LEE , Sang Jin KWON , Won Bae KWON , Dae Seon KIM , Dae Woong MOON , Soo Yong JUNG , Gye Sul CHO
Abstract: A highly integrated multi-channel optical module is provided. The optical module includes an optical source device mounted on a substrate by an optical source mount unit, a waveguide mounted on the substrate by a waveguide mount unit, a lens mount unit disposed between the optical source device and the waveguide and mounted on the substrate, and a lens unit fixed to the lens mount unit by an adhesive cured by ultraviolet (UV) parallel light, wherein a light path of the UV parallel light is formed in the lens mount unit by a reflector attached on a side surface of the lens mount unit, and the UV parallel light moves along the light path and cures the adhesive coated on an upper portion of the lens mount unit facing a lower end portion of the lens unit.
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公开(公告)号：US20230061382A1
公开(公告)日：2023-03-02
申请号：US17879008
申请日：2022-08-02
Inventor： Eun Kyu KANG , Jong Jin LEE , Dae Seon KIM , Sang Jin KWON , Won Bae KWON , Soo Yong JUNG , Hae Chung KANG , Dae Woong MOON , Gye Sul CHO
IPC: G02B6/42
Abstract: A multi-channel optical sub-assembly includes a printed circuit board with a signal processor mounted thereon, a package window mounted on the printed circuit board, the package window including a transparent material, a package mounted on the package window, and an optical device accommodated into an inner space of the package and configured to convert an electrical signal, input from the signal processor, into an optical signal, wherein the electrical signal sequentially passes through a window through electrode buried in the package window and a package through electrode buried in the package and is input to the optical device.
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公开(公告)号：US20250076601A1
公开(公告)日：2025-03-06
申请号：US18765891
申请日：2024-07-08
Inventor： Won-Bae KWON , Eun Kyu KANG , Jong Jin LEE , Soo Yong JUNG , Haechung KANG , Myunghwan KIM , Dae Woong MOON , Gye Sul CHO
Abstract: An optical receiving module assembly is provided. The optical receiving module assembly includes an electric sub-assembly including a printed circuit board (PCB) including an opening portion and an electronic device mounted on the PCB and an optical receiving module including a first optical component mounted on the PCB and a second optical component mounted on the mount which includes a transparent material and is disposed in the opening portion, wherein the electronic device and the second optical component are electrically connected to each other by a mount electrode formed on a surface of the mount.
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