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公开(公告)号：US20220094138A1
公开(公告)日：2022-03-24
申请号：US17479496
申请日：2021-09-20
Inventor： Eun Kyu KANG , Jong Jin LEE , Dae Seon KIM , Eun Kyoung JEON , Sang Jin KWON , Won Bae KWON , Kwon Seob LIM , Soo Yong JUNG
IPC: H01S5/024 , G02B27/28 , H01S5/02257 , H01S5/02253 , H01S5/02255 , H04J14/02 , H04B10/40
Abstract: A structure and a manufacturing method of an optical transmission module, in which output light of each of a first optical transmission unit and a second optical transmission unit is combined into one and transmitted through an optical fiber. In order to manufacture the optical transmission module, the first optical transmission unit and the second optical transmission unit are separately manufactured using a wafer-level packaging process and then are stacked. As a result, emission of generated heat is divided into a first heat sink installed in the first optical transmission unit and a second heat sink installed in the second optical transmission unit so that better heat dissipation efficiency is achieved than a conventional optical transmission module. In addition, a mounting area may also be reduced to ½ of the conventional module.
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公开(公告)号：US20210125975A1
公开(公告)日：2021-04-29
申请号：US17081536
申请日：2020-10-27
Inventor： Eun Kyu KANG , Jong Jin LEE , Sang Jin KWON , Won Bae KWON , Dae Seon KIM , Soo Yong JUNG
Abstract: Provided is a cooled optical transmission module device including a silicon wafer having a plurality of platform mounting grooves, each of which serves as a space for mounting in which an optical transmission platform therein, a thermoelectric cooler bonded to the platform mounting groove to transfer heat to outside, the optical transmission platform provided on the thermoelectric cooler and configured to output an optical signal by generating and reflecting the optical signal, a dielectric sub-mount bonded to the platform mounting groove of the silicon wafer and electrically connected to the mounted optical transmission platform, and a cover configured to cover the platform mounting groove of the silicon wafer and seal the platform mounting groove while providing an electric path.
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公开(公告)号：US20240126041A1
公开(公告)日：2024-04-18
申请号：US18485784
申请日：2023-10-12
Inventor： HAECHUNG KANG , Eun Kyu KANG , Jong Jin LEE
CPC classification number: G02B7/003 , G01B9/02089 , G02B6/25 , G02B27/0012
Abstract: An apparatus and method for performing optical alignment between optical waveguide elements in manufacturing a surface mountable optical module, in which a plurality of optical waveguide elements are mounted on a surface of a mounting substrate, is disclosed. A controller performs recognition of the interference pattern included in the image information received from the camera, observes parallelism between the substrate support and the mounting substrate and between the mounting substrate and the optical waveguide element using the recognized pattern, generates a control signal to control the transport device according to the observed parallelism, and transmits the control signal to the transport device to perform control of the optical waveguide element.
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公开(公告)号：US20230069724A1
公开(公告)日：2023-03-02
申请号：US17862930
申请日：2022-07-12
Inventor： Won Bae KWON , Jong Jin LEE , Eun Kyu KANG , Soo Yong JUNG , Hae Chung KANG , Sang Jin KWON , Dae Seon KIM
Abstract: An optical receiver sub-assembly is provided, which includes a substrate, an optical waveguide device mounted on the substrate to transfer ray incident from a ray source, and a photodetector mounted on the substrate and disposed under a vertical cross-sectional surface of the optical waveguide device, wherein the ray is sequentially reflected and refracted by an upper slope surface and a lower slope surface provided in the vertical cross-sectional surface and is vertically incident on an active area of the photodetector.
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公开(公告)号：US20230067645A1
公开(公告)日：2023-03-02
申请号：US17851148
申请日：2022-06-28
Inventor： Hae Chung KANG , Eun Kyu KANG , Jong Jin LEE , Sang Jin KWON , Won Bae KWON , Dae Seon KIM , Dae Woong MOON , Soo Yong JUNG , Gye Sul CHO
Abstract: A highly integrated multi-channel optical module is provided. The optical module includes an optical source device mounted on a substrate by an optical source mount unit, a waveguide mounted on the substrate by a waveguide mount unit, a lens mount unit disposed between the optical source device and the waveguide and mounted on the substrate, and a lens unit fixed to the lens mount unit by an adhesive cured by ultraviolet (UV) parallel light, wherein a light path of the UV parallel light is formed in the lens mount unit by a reflector attached on a side surface of the lens mount unit, and the UV parallel light moves along the light path and cures the adhesive coated on an upper portion of the lens mount unit facing a lower end portion of the lens unit.
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Patent Agency Ranking
公开(公告)号：US20250076601A1
公开(公告)日：2025-03-06
申请号：US18765891
申请日：2024-07-08
Inventor： Won-Bae KWON , Eun Kyu KANG , Jong Jin LEE , Soo Yong JUNG , Haechung KANG , Myunghwan KIM , Dae Woong MOON , Gye Sul CHO
Abstract: An optical receiving module assembly is provided. The optical receiving module assembly includes an electric sub-assembly including a printed circuit board (PCB) including an opening portion and an electronic device mounted on the PCB and an optical receiving module including a first optical component mounted on the PCB and a second optical component mounted on the mount which includes a transparent material and is disposed in the opening portion, wherein the electronic device and the second optical component are electrically connected to each other by a mount electrode formed on a surface of the mount.
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公开(公告)号：US20240106540A1
公开(公告)日：2024-03-28
申请号：US18328845
申请日：2023-06-05
Inventor： Eun Kyu KANG , Jong Jin LEE
CPC classification number: H04B10/40 , H05K1/118 , H05K2201/10121
Abstract: An optical transceiver is provided. A transceiver optical sub-assembly included in the optical transceiver includes a package body, accommodating optical devices and including a front surface coupled to an optical signal terminal, and a feed-through structure closing a rear surface of the package body and an open portion provided at both side surfaces adjacent to the rear surface. A disposition portion where one end of a flexible printed circuit board (FPCB) is disposed is provided at a front surface of the feed-through structure. Feed-through electrodes bonded to FPCB electrodes provided at the one end of the FPCB are provided on a surface of the disposition portion. For precise alignment of the FPCB electrodes and the feed-through electrodes, a protrusion portion is provided at the one end of the FPCB, and an insertion groove into which the protrusion portion is inserted is formed in a front surface of the feed-through structure.
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公开(公告)号：US20190041590A1
公开(公告)日：2019-02-07
申请号：US16042969
申请日：2018-07-23
Inventor： Soo Yong JUNG , Jong Jin LEE , Eun Kyu KANG , Won Bae KWON , Jeong Eun KIM
IPC: G02B6/42
CPC classification number: G02B6/4244 , G02B6/42 , G02B6/4204 , G02B6/4239 , G02B6/424 , G02B6/4245
Abstract: Provided are an optical module platform structure and a method of manufacturing the same. The optical module platform structure includes an optical module platform substrate, a light source device mounted on a light source mount attached on one upper side of the optical module platform substrate, a waveguide spaced apart from the light source device by a certain interval and mounted on a waveguide mount attached on the optical module platform substrate, a lens mount fixed between the light source mount and the waveguide mount, and a lens fixed to a top of the lens mount. Therefore, optical coupling efficiency between a light source and a waveguide is maximized by applying a lens mount, and an optical alignment error is minimized.
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公开(公告)号：US20250158349A1
公开(公告)日：2025-05-15
申请号：US18827421
申请日：2024-09-06
Inventor： Eun Kyu KANG , Haechung KANG , Jong Jin LEE , Won-Bae KWON , Soo Yong JUNG , Sangjin KWON , Myunghwan KIM
IPC: H01S5/02253 , H01S5/02251 , H01S5/02315 , H01S5/40
Abstract: Provided is a lens curing device for a multi-channel optical module, which cures a lens after arranging the lens on multiple axes between a laser diode and an optical waveguide of the optical module for each channel, the lens curing device including a vacuum collet that picks up the lens, a driver that moves the vacuum collet that picks up the lens and disposes the moved vacuum collet at an arrangement position of a submount, and an optical fiber that is embedded in at least a portion of the vacuum collet while connected to an ultraviolet (UV) light source in a preset wavelength band and transmits light radiated from the UV light source to a UV epoxy applied to a lower end of the lens.
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公开(公告)号：US20250093599A1
公开(公告)日：2025-03-20
申请号：US18883663
申请日：2024-09-12
Inventor： Won-Bae KWON , Eun Kyu KANG , Jong Jin LEE , Soo Yong JUNG , Haechung KANG , Sangjin KWON , Myunghwan KIM
IPC: G02B6/42
Abstract: An optical module assembly is provided. The optical module assembly includes an electric sub-assembly including a printed circuit board (PCB) and an electronic device mounted on the PCB and an optical module including an interposer including a transparent material, an optical sub-assembly accommodating optical components, and a cover covering an upper portion of the optical sub-assembly, wherein one end portion of the PCB is inserted into the optical sub-assembly through an inserting hole formed in a sidewall of the optical sub-assembly, and the optical components and a substrate electrode formed on a surface of the one end portion of the PCB are electrically connected to each other by the interposer.
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