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公开(公告)号：US20190025517A1
公开(公告)日：2019-01-24
申请号：US15866697
申请日：2018-01-10
Inventor： Won Bae KWON , Jong Jin Lee , Eun Kyu Kang , Jeong Eun Kim , Soo Yong Jung
Abstract: The present invention relates to an optical module, and more specifically, to an optical module which allows an optical coupling loss of an optical signal to be minimized and a frequency bandwidth thereof to be maximized. The optical module according to an embodiment of the present invention includes: a circuit substrate; an electronic element mounted on one surface of the circuit substrate; an optical element mounted on another surface perpendicular to the one surface of the circuit substrate; a capacitor mounted between the electronic element and the optical element; and an optical waveguide array on which an optical waveguide is disposed.
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公开(公告)号：US20230061382A1
公开(公告)日：2023-03-02
申请号：US17879008
申请日：2022-08-02
Inventor： Eun Kyu KANG , Jong Jin LEE , Dae Seon KIM , Sang Jin KWON , Won Bae KWON , Soo Yong JUNG , Hae Chung KANG , Dae Woong MOON , Gye Sul CHO
IPC: G02B6/42
Abstract: A multi-channel optical sub-assembly includes a printed circuit board with a signal processor mounted thereon, a package window mounted on the printed circuit board, the package window including a transparent material, a package mounted on the package window, and an optical device accommodated into an inner space of the package and configured to convert an electrical signal, input from the signal processor, into an optical signal, wherein the electrical signal sequentially passes through a window through electrode buried in the package window and a package through electrode buried in the package and is input to the optical device.
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Patent Agency Ranking
公开(公告)号：US20190041590A1
公开(公告)日：2019-02-07
申请号：US16042969
申请日：2018-07-23
Inventor： Soo Yong JUNG , Jong Jin LEE , Eun Kyu KANG , Won Bae KWON , Jeong Eun KIM
IPC: G02B6/42
CPC classification number: G02B6/4244 , G02B6/42 , G02B6/4204 , G02B6/4239 , G02B6/424 , G02B6/4245
Abstract: Provided are an optical module platform structure and a method of manufacturing the same. The optical module platform structure includes an optical module platform substrate, a light source device mounted on a light source mount attached on one upper side of the optical module platform substrate, a waveguide spaced apart from the light source device by a certain interval and mounted on a waveguide mount attached on the optical module platform substrate, a lens mount fixed between the light source mount and the waveguide mount, and a lens fixed to a top of the lens mount. Therefore, optical coupling efficiency between a light source and a waveguide is maximized by applying a lens mount, and an optical alignment error is minimized.
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公开(公告)号：US20230069724A1
公开(公告)日：2023-03-02
申请号：US17862930
申请日：2022-07-12
Inventor： Won Bae KWON , Jong Jin LEE , Eun Kyu KANG , Soo Yong JUNG , Hae Chung KANG , Sang Jin KWON , Dae Seon KIM
Abstract: An optical receiver sub-assembly is provided, which includes a substrate, an optical waveguide device mounted on the substrate to transfer ray incident from a ray source, and a photodetector mounted on the substrate and disposed under a vertical cross-sectional surface of the optical waveguide device, wherein the ray is sequentially reflected and refracted by an upper slope surface and a lower slope surface provided in the vertical cross-sectional surface and is vertically incident on an active area of the photodetector.
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公开(公告)号：US20230067645A1
公开(公告)日：2023-03-02
申请号：US17851148
申请日：2022-06-28
Inventor： Hae Chung KANG , Eun Kyu KANG , Jong Jin LEE , Sang Jin KWON , Won Bae KWON , Dae Seon KIM , Dae Woong MOON , Soo Yong JUNG , Gye Sul CHO
Abstract: A highly integrated multi-channel optical module is provided. The optical module includes an optical source device mounted on a substrate by an optical source mount unit, a waveguide mounted on the substrate by a waveguide mount unit, a lens mount unit disposed between the optical source device and the waveguide and mounted on the substrate, and a lens unit fixed to the lens mount unit by an adhesive cured by ultraviolet (UV) parallel light, wherein a light path of the UV parallel light is formed in the lens mount unit by a reflector attached on a side surface of the lens mount unit, and the UV parallel light moves along the light path and cures the adhesive coated on an upper portion of the lens mount unit facing a lower end portion of the lens unit.
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公开(公告)号：US20220094138A1
公开(公告)日：2022-03-24
申请号：US17479496
申请日：2021-09-20
Inventor： Eun Kyu KANG , Jong Jin LEE , Dae Seon KIM , Eun Kyoung JEON , Sang Jin KWON , Won Bae KWON , Kwon Seob LIM , Soo Yong JUNG
IPC: H01S5/024 , G02B27/28 , H01S5/02257 , H01S5/02253 , H01S5/02255 , H04J14/02 , H04B10/40
Abstract: A structure and a manufacturing method of an optical transmission module, in which output light of each of a first optical transmission unit and a second optical transmission unit is combined into one and transmitted through an optical fiber. In order to manufacture the optical transmission module, the first optical transmission unit and the second optical transmission unit are separately manufactured using a wafer-level packaging process and then are stacked. As a result, emission of generated heat is divided into a first heat sink installed in the first optical transmission unit and a second heat sink installed in the second optical transmission unit so that better heat dissipation efficiency is achieved than a conventional optical transmission module. In addition, a mounting area may also be reduced to ½ of the conventional module.
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公开(公告)号：US20210125975A1
公开(公告)日：2021-04-29
申请号：US17081536
申请日：2020-10-27
Inventor： Eun Kyu KANG , Jong Jin LEE , Sang Jin KWON , Won Bae KWON , Dae Seon KIM , Soo Yong JUNG
Abstract: Provided is a cooled optical transmission module device including a silicon wafer having a plurality of platform mounting grooves, each of which serves as a space for mounting in which an optical transmission platform therein, a thermoelectric cooler bonded to the platform mounting groove to transfer heat to outside, the optical transmission platform provided on the thermoelectric cooler and configured to output an optical signal by generating and reflecting the optical signal, a dielectric sub-mount bonded to the platform mounting groove of the silicon wafer and electrically connected to the mounted optical transmission platform, and a cover configured to cover the platform mounting groove of the silicon wafer and seal the platform mounting groove while providing an electric path.
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