公开(公告)号：US09955569B2

公开(公告)日：2018-04-24

申请号：US15363556

申请日：2016-11-29

Applicant: ELITE MATERIAL CO., LTD.

Inventor： Ya-Wen Kuo ,  Li-Chih Yu ,  Ching-Hsin Ho

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/46 ,  H05K1/09 ,  H05K1/03

CPC classification number: H05K1/0271 ,  H05K1/0366 ,  H05K1/09 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/029 ,  H05K2201/0355 ,  H05K2201/068

Abstract: A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers.

公开(公告)号：US09545018B2

公开(公告)日：2017-01-10

申请号：US14558193

申请日：2014-12-02

Applicant: Elite Material Co., Ltd.

Inventor： Ya-Wen Kuo ,  Li-Chih Yu ,  Ching-Hsin Ho

IPC: H05K1/03 ,  H05K3/46

CPC classification number: H05K1/0271 ,  H05K1/0366 ,  H05K1/09 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/029 ,  H05K2201/0355 ,  H05K2201/068

Abstract: A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers.

Abstract translation: 多层印刷电路板包括：芯，其包括芯绝缘层和形成在芯绝缘层的两侧上的迹线; 在芯的两侧依次形成多个绝缘层; 以及分别形成在两个绝缘层之间和最外层绝缘层上的多个迹线层; 所述芯绝缘层含有不同于所述绝缘层的树脂材料，使得所述芯绝缘层的尺寸稳定性优于所述绝缘层的尺寸稳定性。