公开(公告)号：US09955569B2

公开(公告)日：2018-04-24

申请号：US15363556

申请日：2016-11-29

Applicant: ELITE MATERIAL CO., LTD.

Inventor： Ya-Wen Kuo ,  Li-Chih Yu ,  Ching-Hsin Ho

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/46 ,  H05K1/09 ,  H05K1/03

CPC classification number: H05K1/0271 ,  H05K1/0366 ,  H05K1/09 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/029 ,  H05K2201/0355 ,  H05K2201/068

Abstract: A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers.

公开(公告)号：US09392683B2

公开(公告)日：2016-07-12

申请号：US14554923

申请日：2014-11-26

Applicant: Elite Material Co., Ltd.

Inventor： Ming-Chuan Chang ,  Li-Chih Yu ,  Yu-Te Lin

IPC: H05K1/02 ,  H01P3/08 ,  H05K1/03

CPC classification number: H05K1/024 ,  H01P3/082 ,  H05K1/0242 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/0298 ,  H05K1/0353 ,  H05K1/0366 ,  H05K2201/029

Abstract: A multi-layer printed circuit board comprises: at least two insulation layers, respectively having glass fiber cloth and cured resin covering thereon, the insulation layers being stacked on each other; an internal trace layer formed between two neighboring insulation layers; and an external trace layer formed on an outer surface of the outermost insulation layer; wherein the insulation layers have a dielectric constant of 3.4 or less, and the internal and external trace layers have a trace width between 40 and 75 micrometers, such that the multi-layer printed circuit board has a characteristic impedance between 45 and 55Ω in single-ended signaling and between 90 and 110Ω in differential signaling.

Abstract translation: 多层印刷电路板包括：分别具有玻璃纤维布和覆盖在其上的固化树脂的至少两个绝缘层，所述绝缘层彼此堆叠; 在两个相邻绝缘层之间形成的内部迹线层; 以及形成在最外绝缘层的外表面上的外部迹线层; 其中所述绝缘层具有3.4或更小的介电常数，并且所述内部和外部迹线层具有介于40和75微米之间的迹线宽度，使得所述多层印刷电路板具有在45和55之间的特征阻抗; 在单端信令和90和110之间和OHgr; 差分信号。

公开(公告)号：US09279051B2

公开(公告)日：2016-03-08

申请号：US13680568

申请日：2012-11-19

Applicant: ELITE MATERIAL CO., LTD.

Inventor： Li-Chih Yu ,  Tse-An Lee

IPC: C08G73/06 ,  C08K3/00 ,  C08K3/26 ,  C08K3/36 ,  C08K5/09 ,  C08K5/5399 ,  H05K1/03 ,  H05K3/22 ,  B32B15/08 ,  C08L65/00 ,  C08L79/04 ,  C08L35/06 ,  H05K3/02

CPC classification number: C08L65/00 ,  B32B15/08 ,  C08G73/0655 ,  C08K3/013 ,  C08K3/26 ,  C08K3/36 ,  C08K5/09 ,  C08K5/5399 ,  C08L35/06 ,  C08L71/12 ,  C08L79/04 ,  H05K1/0353 ,  H05K3/022 ,  H05K2201/012 ,  Y10T428/31699 ,  C08K3/0033

Abstract: The halogen-free resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 10 to 150 parts by weight of phosphazene; and (E) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.

Abstract translation: 无卤树脂组合物包含（A）100重量份氰酸酯树脂; （B）5〜50重量份苯乙烯 - 马来酸酐; （C）5〜100重量份聚苯醚树脂; （D）10〜150重量份的磷腈; 和（E）10〜1000重量份的无机填料。 通过使用特定比例的特定成分，无卤树脂组合物具有低介电常数，低耗散因数，高耐热性和高阻燃性的特点，可制成预浸料或树脂膜，从而用于铜包覆 层压板或印刷电路板。

公开(公告)号：US09545018B2

公开(公告)日：2017-01-10

申请号：US14558193

申请日：2014-12-02

Applicant: Elite Material Co., Ltd.

Inventor： Ya-Wen Kuo ,  Li-Chih Yu ,  Ching-Hsin Ho

IPC: H05K1/03 ,  H05K3/46

CPC classification number: H05K1/0271 ,  H05K1/0366 ,  H05K1/09 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/029 ,  H05K2201/0355 ,  H05K2201/068

Abstract: A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers.

Abstract translation: 多层印刷电路板包括：芯，其包括芯绝缘层和形成在芯绝缘层的两侧上的迹线; 在芯的两侧依次形成多个绝缘层; 以及分别形成在两个绝缘层之间和最外层绝缘层上的多个迹线层; 所述芯绝缘层含有不同于所述绝缘层的树脂材料，使得所述芯绝缘层的尺寸稳定性优于所述绝缘层的尺寸稳定性。

公开(公告)号：US09394438B2

公开(公告)日：2016-07-19

申请号：US13759800

申请日：2013-02-05

Applicant: ELITE MATERIAL CO., LTD.

Inventor： Li-Chih Yu ,  Tse-An Lee

IPC: B32B27/38 ,  C08L63/00

CPC classification number: C08L63/00 ,  Y10T428/31529 ,  C08L25/18 ,  C08L67/00 ,  C08L79/02 ,  C08L79/04

Abstract: A resin composition includes (A) an epoxy resin; (B) a benzoxazine (BZ) resin; (C) a styrene maleic anhydride (SMA) copolymer; and (D) a polyester. The resin composition includes specific ingredients of a polyester and is characterized by specific proportions thereof so as to achieve a low delta Tg value of copper clad laminates manufactured in accordance with the resin composition and attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high fire retardation of the copper clad laminates and printed circuit boards manufactured in accordance with the resin composition.

Abstract translation: 树脂组合物包含（A）环氧树脂; （B）苯并恶嗪（BZ）树脂; （C）苯乙烯马来酸酐（SMA）共聚物; 和（D）聚酯。 树脂组合物包括聚酯的特定成分，其特征在于其特定比例，以便实现根据树脂组合物制造的覆铜层压板的低ΔTg值，并获得低介电常数，低介电损耗因子，高 根据树脂组合物制造的覆铜层压板和印刷电路板的耐热性，高阻燃性。