公开(公告)号：US20220204764A1

公开(公告)日：2022-06-30

申请号：US17551547

申请日：2021-12-15

Applicant: EMS-CHEMIE AG

Inventor： Arda ALKAN ,  Andri CADALBERT ,  Andreas BAYER ,  Botho HOFFMANN

IPC: C08L77/06 ,  C08G69/26

Abstract: The present invention relates to polyamide compounds having high heat aging resistance which, in addition to a specific polyamide, comprise at least one unsubstituted or substituted metallocene, optionally at least one impact modifier and optionally at least one additive. The invention also relates to the use of said polyamide compounds for the production of molds.

公开(公告)号：US20220195186A1

公开(公告)日：2022-06-23

申请号：US17551371

申请日：2021-12-15

Applicant: EMS-CHEMIE AG

Inventor： Arda ALKAN ,  Andri CADALBERT ,  Andreas BAYER ,  Botho HOFFMANN

IPC: C08L77/06

Abstract: The present invention relates to filled polyamide moulding compounds with a high heat-ageing resistance which, besides a specific polyamide mixture, also comprise at least one filler, at least one unsubstituted or substituted metallocene and optionally at least one additive. The invention also relates to the use of these polyamide moulding compounds to produce moulded articles.

公开(公告)号：US20210189125A1

公开(公告)日：2021-06-24

申请号：US17129507

申请日：2020-12-21

Applicant: EMS-CHEMIE AG

Inventor： Arda ALKAN ,  Thomas WIEDEMANN ,  Andri CADALBERT ,  Manfred HEWEL ,  Botho HOFFMANN

IPC: C08L77/08 ,  C08K7/14 ,  C08K5/134

Abstract: The present invention relates to the use of a polyamide molding compound for application purposes in which a high resistance to hypochlorous acid is decisive. The molding compound is thus used in accordance with the invention for molds that are suitable for contact with aqueous solutions containing hypochlorous acid.

公开(公告)号：US20210189124A1

公开(公告)日：2021-06-24

申请号：US17129606

申请日：2020-12-21

Applicant: EMS-CHEMIE AG

Inventor： Arda ALKAN ,  Thomas WIEDEMANN ,  Andri CADALBERT ,  Manfred HEWEL ,  Botho HOFFMANN

IPC: C08L77/06

Abstract: The present invention relates to the use of a polyamide molding compound for application purposes in which high resistance to hypochlorous acid is crucial. The molding compound is thus used according to the invention for molded bodies suitable for being in contact with aqueous, hypochlorous acid-containing solutions.