公开(公告)号：US20220177649A1

公开(公告)日：2022-06-09

申请号：US17457309

申请日：2021-12-02

Applicant: EMS-CHEMIE AG

Inventor： Thomas WIEDEMANN ,  Etienne AEPLI

IPC: C08G69/26 ,  C08K5/09 ,  C08G69/32

Abstract: A transparent polyamide moulding with high resistance to steam, containing at least one copolyamide with polyamide units AB/AC/D, wherein: (A) is selected as a cycloaliphatic diamine from the group: MACM and PACM; (B) is selected as an aromatic dicarboxylic acid from the group: isophthalic acid (I), naphthalenedicarboxylic acid, and terephthalic acid (T); (C) is selected as an aliphatic dicarboxylic acid from the group: decanedioic acid, undecanedioic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, pentadecanedioic acid, hexadecanedioic acid; and (D) is selected as at least one lactam or α,ω-aminocarboxylic acid from the group: laurolactam, undecanolactam, 12-aminododecanoic acid, and 11-aminoundecanoic acid, wherein: the proportions of polyamide units AB are from 30 to 45 mol %, the proportions of polyamide units AC are from 30 to 40 mol %, and the proportions of polyamide units D are from 20 to 32 mol %, and wherein the sum total of polyamide units AB, AC and D is 100 mol %.

公开(公告)号：US20210189125A1

公开(公告)日：2021-06-24

申请号：US17129507

申请日：2020-12-21

Applicant: EMS-CHEMIE AG

Inventor： Arda ALKAN ,  Thomas WIEDEMANN ,  Andri CADALBERT ,  Manfred HEWEL ,  Botho HOFFMANN

IPC: C08L77/08 ,  C08K7/14 ,  C08K5/134

Abstract: The present invention relates to the use of a polyamide molding compound for application purposes in which a high resistance to hypochlorous acid is decisive. The molding compound is thus used in accordance with the invention for molds that are suitable for contact with aqueous solutions containing hypochlorous acid.

公开(公告)号：US20210189124A1

公开(公告)日：2021-06-24

申请号：US17129606

申请日：2020-12-21

Applicant: EMS-CHEMIE AG

Inventor： Arda ALKAN ,  Thomas WIEDEMANN ,  Andri CADALBERT ,  Manfred HEWEL ,  Botho HOFFMANN

IPC: C08L77/06

Abstract: The present invention relates to the use of a polyamide molding compound for application purposes in which high resistance to hypochlorous acid is crucial. The molding compound is thus used according to the invention for molded bodies suitable for being in contact with aqueous, hypochlorous acid-containing solutions.