公开(公告)号：US20220204687A1

公开(公告)日：2022-06-30

申请号：US17601814

申请日：2020-04-07

Applicant: ENEOS Corporation

Inventor： Atsushi KAMEYAMA

IPC: C08G59/24 ,  C08G59/68 ,  C08G59/50

Abstract: Disclosed is a curable composition capable of producing a cured product having excellent heat resistance and low outgassing properties. In particular, the curable composition comprises an epoxy compound represented by formula (1): wherein R1 to R4, R7 to R12, and R15 to R18 are each independently selected from the group consisting of hydrogen, an alkyl group, and an alkoxy group; R5, R6, R13, and R14 are each independently selected from the group consisting of hydrogen, an alkyl group, and an alkoxy group; with the optional exception that one of R5 or R6 and one of R13 or R14 forms a cross-linked structure represented by —CH2—, and n is an integer of 0 or 1, and a cationic polymerization initiator containing a Lewis acid and a Lewis base.

公开(公告)号：US20230023687A1

公开(公告)日：2023-01-26

申请号：US17782082

申请日：2020-12-01

Applicant: ENEOS Corporation

Inventor： Kenta UE ,  Takeshi KOIKE ,  Atsushi KAMEYAMA

IPC: C08F222/10 ,  C08F220/32 ,  C08F220/06 ,  C08F220/14 ,  C08F2/50 ,  C08K5/09

Abstract: The present invention provides an alicyclic epoxy acrylate compound that can have high heat resistance in the form of a cured product when contained in a curable composition, a curable composition, and a cured product.
An alicyclic epoxy acrylate compound represented by the following Formula (1) where A denotes an oxygen atom and a curable composition comprising thereof are used: wherein one of R1 and R2 is a (meth)acryloyloxy group, the other of R1 and R2 is a hydrogen atom, R3 to R20 are each independently selected from the group consisting of a hydrogen atom, an alkyl group, and an alkoxy group, and A is an oxygen atom or A is not present, and a carbon atom to which R8 binds and a carbon atom to which R9 binds together form a double bond.

公开(公告)号：US20210340118A1

公开(公告)日：2021-11-04

申请号：US17274123

申请日：2019-08-19

Applicant: ENEOS CORPORATION

Inventor： Shohei TAKATA ,  Kenta UE ,  Takeshi KOIKE ,  Atsushi KAMEYAMA

IPC: C07D301/12 ,  C07D493/04 ,  C07D407/04 ,  B01J23/30 ,  B01J31/02 ,  B01J27/055

Abstract: The invention provides a method for producing an epoxy compound by hydrogen peroxide using an organic compound having a carbon-carbon double bond as a raw material, wherein a by-product is suppressed from being generated and the epoxy compound is produced in a high yield. In particular, the invention provides a method for producing an epoxy compound involving oxidizing a carbon-carbon double bond in an organic compound with hydrogen peroxide in the presence of a catalyst, wherein the catalyst comprises a tungsten compound; a phosphoric acid, a phosphonic acid or salts thereof; and an onium salt having an alkyl sulfate ion represented by formula (I) as an anion: wherein R1 is a linear or branched aliphatic hydrocarbon group having 1 to 18 carbons, which may be substituted with 1 to 3 phenyl groups.

公开(公告)号：US20210206916A1

公开(公告)日：2021-07-08

申请号：US17178474

申请日：2021-02-18

Applicant: ENEOS CORPORATION

Inventor： Atsushi KAMEYAMA ,  Ryuichi UENO ,  Hisashi SONE ,  Shohei TAKATA ,  Takashi SEKI

IPC: C08G65/26

Abstract: The present invention discloses a curable composition comprising: an epoxy compound represented by the following Formula (1); and one selected from the group consisting of: a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator as well as the cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance. (In the Formula (1), A represents CR17R18; B represents CR19R20; R1 to R20 each independently represents a substituent selected from the group consisting of a hydrogen atom, an alkyl group and an alkoxy group; and n represents 0 or 1, with the proviso that when n is 0, m represents 1, and when n is 1, m represents 0.)