公开(公告)号：US20210206916A1

公开(公告)日：2021-07-08

申请号：US17178474

申请日：2021-02-18

Applicant: ENEOS CORPORATION

Inventor： Atsushi KAMEYAMA ,  Ryuichi UENO ,  Hisashi SONE ,  Shohei TAKATA ,  Takashi SEKI

IPC: C08G65/26

Abstract: The present invention discloses a curable composition comprising: an epoxy compound represented by the following Formula (1); and one selected from the group consisting of: a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator as well as the cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance. (In the Formula (1), A represents CR17R18; B represents CR19R20; R1 to R20 each independently represents a substituent selected from the group consisting of a hydrogen atom, an alkyl group and an alkoxy group; and n represents 0 or 1, with the proviso that when n is 0, m represents 1, and when n is 1, m represents 0.)