公开(公告)号：US20210190820A1

公开(公告)日：2021-06-24

申请号：US16768044

申请日：2018-06-29

Applicant: ENPLAS CORPORATION

Inventor： Kazutaka KOSHIISHI ,  Keiichi NARUMI

IPC: G01R1/04 ,  G01R31/28 ,  H01R12/71 ,  G01R1/067

Abstract: This electrical connection socket for relaying exchange of electrical signals between a first electrical component and a second electrical component, is provided with: a signal pin which is inserted in a communication hole of a metallic casing so as to form a coaxial line path between the inner wall surface of the communication hole and the outer circumferential surface of the signal pin so that one end of the signal pin is electrically connected to a terminal of the first electrical component while the other end is electrically connected to a terminal of the second electrical component; and a holding member which holds the signal pin in the communication hole such that the outer circumferential surface of the signal pin is separated from the inner wall surface of the communication hole, wherein the characteristic impedance of a signal path formed by the signal pin in a first region where the signal pin is held by the holding member is smaller than a predetermined characteristic impedance which is a reference, and the characteristic impedance in a second region adjacent to the first region is larger than the predetermined characteristic impedance.

公开(公告)号：US20200350716A1

公开(公告)日：2020-11-05

申请号：US16761253

申请日：2018-06-29

Applicant: Enplas Corporation

Inventor： Keiichi NARUMI

IPC: H01R12/71 ,  G01R1/073 ,  G01R1/067 ,  H01R12/57 ,  H01R13/193

Abstract: An electric connection socket for relaying electric signals between a circuit substrate and an electric component includes: a metal housing which has a through hole enabling communication between the top surface and the bottom surface thereof, and on the top surface of which the electric component is mounted and on the bottom surface of which the circuit substrate is mounted; and a signal pin inserted into the through hole to configure a coaxial line between the inner wall surfaces of the through hole, and which is electrically connected at one end to a signal path pad electrode of the circuit substrate and is electrically connected at the other end to a signal path terminal of the electric component. The metal housing is arranged on the circuit substrate such that an air gap is formed between the bottom surface of the metal housing and the top surface of the circuit substrate.

公开(公告)号：US20220294162A1

公开(公告)日：2022-09-15

申请号：US17514151

申请日：2021-10-29

Applicant: Enplas Corporation

Inventor： Keiichi NARUMI ,  Kazutaka KOSHIISHI

IPC: H01R13/6599 ,  H01R12/71 ,  H01R13/15 ,  H01R13/6588

Abstract: A socket for electrically connecting an upper first part and a lower second part, the socket includes: a pin that contacts the first part and the second part; a main body made of a non-conductive material; a holder that penetrates the main body vertically and holds the pin; and a conductive layer provided on an inner circumferential surface of the holder to surround the pin.

公开(公告)号：US20210408736A1

公开(公告)日：2021-12-30

申请号：US16761254

申请日：2018-06-29

Applicant: Enplas Corporation

Inventor： Keiichi NARUMI

IPC: H01R13/6594 ,  H01R13/6473 ,  H01R12/71 ,  G01R1/067 ,  G01R1/073

Abstract: An electric connection socket for relaying electric signals between a circuit substrate and an electric component includes: a metal housing which has a through hole enabling communication between the top surface and the bottom surface thereof, and on the top surface of which the electric component is mounted and on the bottom surface of which the circuit substrate is mounted; and a signal pin inserted into the through hole to configure a coaxial line between the inner wall surfaces of the through hole, and which is electrically connected at one end to a signal path first pad electrode of the circuit substrate and is electrically connected at the other end to a signal path terminal of the electric component. On the bottom surface, the metal housing has a ground connection unit which contacts a second pad electrode for grounding formed on the circuit substrate and which grounds the metal housing.

公开(公告)号：US20160308293A1

公开(公告)日：2016-10-20

申请号：US15108282

申请日：2014-12-24

Applicant: ENPLAS CORPORATION

Inventor： Keiichi NARUMI

IPC: H01R12/71 ,  H05K7/20 ,  H01R12/70

CPC classification number: H01R12/714 ,  G01R1/0466 ,  H01R12/7058 ,  H01R2201/20 ,  H05K7/20418

Abstract: An IC socket includes: a socket main body having an accommodating part for accommodating an IC package; a socket cover having a one-side end portion pivotally supported by the socket main body, and the other-side end portion which is located opposite to the one-side end portion and lockable to the socket main body; and a heat dissipating member mounted on the socket cover and caused to press the IC package. The socket cover includes a metal plate extending from the one-side end portion to the other-side end portion so that the thickness direction of the metal plate is parallel to the direction in which the socket cover faces the accommodating part when the other-side end portion is locked to the socket main body. The metal plate has a depression formed by bending the metal plate.

Abstract translation: IC插座包括：插座主体，具有容纳IC封装的容纳部分; 插座盖，其具有由插座主体枢转地支撑的一侧端部，并且另一侧端部与所述一侧端部相对并且可锁定到所述插座主体; 以及安装在插座盖上并使IC封装件按压的散热构件。 插座盖包括从一侧端部向另一侧端部延伸的金属板，使得金属板的厚度方向平行于插座盖朝向容纳部的方向，而另一侧 端部被锁定到插座主体。 金属板具有通过弯曲金属板形成的凹陷。