公开(公告)号：US20240262757A1

公开(公告)日：2024-08-08

申请号：US18383379

申请日：2023-10-24

Applicant: ENTEGRIS, INC.

Inventor： Shandon T. Fullingim ,  Hugo Vargas

IPC: C04B41/50 ,  C04B35/565 ,  C04B38/00 ,  C04B41/53

CPC classification number: C04B41/5096 ,  C04B35/565 ,  C04B38/0054 ,  C04B41/53

Abstract: The present disclosure includes a method of forming a polished surface. Forming the polished surface can include grinding an initial ceramic substrate to form a ground ceramic substrate; infiltrating the ground ceramic substrate with silicon; and polishing the silicon-infiltrated ceramic substrate, thereby forming the polished surface.