公开(公告)号：US20200324386A1

公开(公告)日：2020-10-15

申请号：US16843135

申请日：2020-04-08

Applicant: ENTEGRIS, INC.

Inventor： Doruk YENER ,  Conrad SURIAGA ,  Joseph SOUSA ,  Laundy OEUR ,  Joseph RIVERS ,  Elango BALU

IPC: B24B53/017 ,  B24B53/12

Abstract: A pad conditioner and chemical mechanical planarization (CMP) pad conditioner assembly for a CMP assembly are disclosed. The pad conditioner includes a substrate having a first surface and a second surface opposite the first surface. A plurality of protrusions protrude away from the first surface in a direction that is normal to the first surface. The plurality of protrusions are arranged in a plurality of rows. A first row of the plurality of rows is offset from a second row of the plurality of rows.