公开(公告)号：US20160020378A1

公开(公告)日：2016-01-21

申请号：US14867759

申请日：2015-09-28

Applicant: EPCOS AG

Inventor： Charles Binninger ,  Ulrich Knauer ,  Helmut Zottl ,  Werner Ruile ,  Tomasz Jewula ,  Rudolf Nuessl

IPC: H01L41/047 ,  H01L41/29 ,  H01L41/187

CPC classification number: H01L41/0477 ,  H01L23/49844 ,  H01L23/49866 ,  H01L41/0472 ,  H01L41/1873 ,  H01L41/29 ,  H01L2924/0002 ,  H03H9/02929 ,  H03H9/14538 ,  H05K1/0265 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/048 ,  H05K3/388 ,  H05K2201/0338 ,  H01L2924/00

Abstract: A metallization, for carrying current in an electrical component, includes a bottom layer overlying a substrate surface and includes titanium (Ti) or a titanium compound as main constituent. An upper layer overlies the bottom layer and includes copper (Cu) as main constituent. The bottom layer and the upper layer form a base layer. A top layer is in direct contact with the upper layer and includes aluminum (Al) as main constituent. The base layer further includes a middle layer, consisting of silver, that is arranged between the bottom layer and the upper layer.

Abstract translation: 用于在电气部件中承载电流的金属化包括覆盖衬底表面的底层，并且包括钛（Ti）或钛化合物作为主要成分。 上层位于底层，包括铜（Cu）作为主要成分。 底层和上层形成基层。 顶层与上层直接接触，包括铝（Al）作为主要成分。 基底层还包括布置在底层和上层之间的由银组成的中间层。