公开(公告)号：US20110109403A1

公开(公告)日：2011-05-12

申请号：US13007708

申请日：2011-01-17

申请人： ERIC GAGNON ,  Chun-Yun Jian

发明人： ERIC GAGNON ,  Chun-Yun Jian

IPC分类号： H01P5/12

CPC分类号： H03H9/0542 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H03H9/0552 ,  Y10T29/49016 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

摘要： A filter package is provided with a support structure, a filter device having terminals, impedance matching circuits formed on the support structure and electrically connected to at least some of the terminals of the filter device, and at least one electrical ground structure electrically connected to the impedance matching circuits. Moreover, the filter package has an outer housing to contain the support structure, filter device, impedance matching circuits, and at least one ground structure.

摘要翻译： 滤波器封装设置有支撑结构，具有端子的滤波器装置，形成在支撑结构上并电连接到过滤器装置的至少一些端子的阻抗匹配电路，以及至少一个电接地结构，电连接到 阻抗匹配电路。 此外，过滤器封装具有外壳，以容纳支撑结构，过滤器装置，阻抗匹配电路和至少一个接地结构。