公开(公告)号：US20180320879A1

公开(公告)日：2018-11-08

申请号：US15972923

申请日：2018-05-07

Applicant: Eaton Intelligent Power Limited

Inventor： Alok Das ,  Anzar Pandurang Rade ,  Omkar Bharat Jadhav ,  Siddhartha Satya Saladi ,  Matthew Allan Canales ,  Sanjeev Bhimasenrao Kulkarni ,  Christopher Lee Bohler ,  Arnab Guha

IPC: F21V29/75 ,  F21V29/85 ,  F21V29/503 ,  F21V29/71

CPC classification number: F21V29/75 ,  F21V29/503 ,  F21V29/71 ,  F21V29/85

Abstract: A heat sink assembly for a light fixture can include at least one heat sink fin disposed in thermal communication with at least one heat-generating component of the light fixture, where the at least one heat sink fin includes a thermoplastic material. The at least one heat sink fin can absorb and dissipate sufficient heat to comply with applicable industry standards for the light fixture.

公开(公告)号：US10522991B2

公开(公告)日：2019-12-31

申请号：US15991224

申请日：2018-05-29

Applicant: EATON INTELLIGENT POWER LIMITED

Inventor： Prashant Pandurang Rode ,  Gordon Pettersen ,  Ben Schermerhorn ,  Arnab Guha ,  Amogh Kank

IPC: H02B1/21 ,  H02G5/02 ,  H02G5/00 ,  H02B13/00 ,  H02G5/08 ,  H02B3/00 ,  H02B1/30

Abstract: A compact busway system for low and medium voltage application is described. In particular, the described compact busway system is designed for low and medium power distribution systems for high current applications. The described compact busway system has a enclosure assembly with at least two side mount supports affixed to the enclosure assembly and at least two horizontal supports, a first horizontal support and a second horizontal support, which are connected and perpendicular to the at least two side mount supports. The compact busway system further includes at least one busbar affixed between the first horizontal support and the second horizontal support, at least one strap connected to the first horizontal support and the second horizontal support, and at least one ground bus connected to the enclosure assembly.

公开(公告)号：US20200158323A1

公开(公告)日：2020-05-21

申请号：US16694104

申请日：2019-11-25

Applicant: Eaton Intelligent Power Limited

Inventor： Alok Das ,  Anzar Pandurang Rade ,  Omkar Bharat Jadhav ,  Siddhartha Satya Saladi ,  Matthew Allan Canales ,  Sanjeev Bhimasenrao Kulkarni ,  Christopher Lee Bohler ,  Arnab Guha

IPC: F21V29/75 ,  F21V29/71 ,  F21V29/503 ,  F21V29/85 ,  F21V29/87 ,  F21V29/51

Abstract: A heat sink assembly for a light fixture can include at least one heat sink fin disposed in thermal communication with at least one heat-generating component of the light fixture, where the at least one heat sink fin includes a thermoplastic material. The at least one heat sink fin can absorb and dissipate sufficient heat to comply with applicable industry standards for the light fixture.