公开(公告)号：US11729906B2

公开(公告)日：2023-08-15

申请号：US16702723

申请日：2019-12-04

Applicant: Eaton Intelligent Power Limited

Inventor： Kaijam M. Woodley ,  Michael K. Balck ,  Matthew J. Koebert

IPC: H01H85/08 ,  H05K1/02 ,  H01H85/046 ,  H01H85/02 ,  H01H69/02 ,  H01H85/10

CPC classification number: H05K1/0293 ,  H01H69/022 ,  H01H85/0241 ,  H01H85/046 ,  H01H85/08 ,  H01H85/10 ,  H01H2085/0275 ,  H05K2201/10181

Abstract: A circuit board with integrated fusing includes an insulating substrate having a circuit trace formed on a surface thereof, the circuit trace including a first circuit trace portion and a second circuit trace portion. A fusible link electrically connects the first circuit trace portion to the second circuit trace portion, the fusible link including a planar surface extending from the first circuit trace portion to the second circuit trace portion. A dielectric reflow encapsulates the fusible link on the planar surface from the first circuit trace portion to the second circuit trace portion.

公开(公告)号：US12156328B2

公开(公告)日：2024-11-26

申请号：US18219460

申请日：2023-07-07

Applicant: Eaton Intelligent Power Limited

Inventor： Kaijam M. Woodley ,  Michael K. Balck ,  Matthew J. Koebert

IPC: H05K1/02 ,  H01H69/02 ,  H01H85/02 ,  H01H85/046 ,  H01H85/08 ,  H01H85/10

Abstract: A circuit board with integrated fusing includes an insulating substrate having a circuit trace formed on a surface thereof, the circuit trace including a first circuit trace portion and a second circuit trace portion. A fusible link electrically connects the first circuit trace portion to the second circuit trace portion, the fusible link including a planar surface extending from the first circuit trace portion to the second circuit trace portion. A dielectric reflow encapsulates the fusible link on the planar surface from the first circuit trace portion to the second circuit trace portion.

公开(公告)号：US20230354512A1

公开(公告)日：2023-11-02

申请号：US18219460

申请日：2023-07-07

Applicant: Eaton Intelligent Power Limited

Inventor： Kaijam M. Woodley ,  Michael K. Balck ,  Matthew J. Koebert

IPC: H05K1/02 ,  H01H85/046 ,  H01H85/02 ,  H01H69/02

CPC classification number: H05K1/0293 ,  H01H85/046 ,  H01H85/0241 ,  H01H69/022 ,  H01H2085/0275 ,  H05K2201/10181 ,  H01H85/08

Abstract: A circuit board with integrated fusing includes an insulating substrate having a circuit trace formed on a surface thereof, the circuit trace including a first circuit trace portion and a second circuit trace portion. A fusible link electrically connects the first circuit trace portion to the second circuit trace portion, the fusible link including a planar surface extending from the first circuit trace portion to the second circuit trace portion. A dielectric reflow encapsulates the fusible link on the planar surface from the first circuit trace portion to the second circuit trace portion.