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公开(公告)号：US20210328522A1
公开(公告)日：2021-10-21
申请号：US17201609
申请日：2021-03-15
Applicant: Eaton Intelligent Power Limited
Inventor： Peter J. Fanduzzi , Paul J. Siebenlist , Mayur Kothari , Michael K. Balck , Sudershan Gawali , Derek Baxter , Craig H. DePas
Abstract: A rectifier assembly includes: a mounting base; and one or more rectification modules configured to be received in the mounting base, each rectification module including: an electronic network including one or more electronic elements configured to convert alternating current (AC) electrical power at an input of the rectification module to direct current (DC) electrical power at an output of the rectification module. Each of the one or more rectification modules is configured to be electrically connected to a DC bus of a driving apparatus that is separate from and independent of the rectifier assembly.
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公开(公告)号：US11729906B2
公开(公告)日：2023-08-15
申请号：US16702723
申请日：2019-12-04
Applicant: Eaton Intelligent Power Limited
Inventor： Kaijam M. Woodley , Michael K. Balck , Matthew J. Koebert
CPC classification number: H05K1/0293 , H01H69/022 , H01H85/0241 , H01H85/046 , H01H85/08 , H01H85/10 , H01H2085/0275 , H05K2201/10181
Abstract: A circuit board with integrated fusing includes an insulating substrate having a circuit trace formed on a surface thereof, the circuit trace including a first circuit trace portion and a second circuit trace portion. A fusible link electrically connects the first circuit trace portion to the second circuit trace portion, the fusible link including a planar surface extending from the first circuit trace portion to the second circuit trace portion. A dielectric reflow encapsulates the fusible link on the planar surface from the first circuit trace portion to the second circuit trace portion.
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Patent Agency Ranking
公开(公告)号：US20230209782A1
公开(公告)日：2023-06-29
申请号：US17987102
申请日：2022-11-15
Applicant: Eaton Intelligent Power Limited
Inventor： Jayakrishnan S. S , Vipin Bokade , Chinmaya Rajiv Dandekar , Michael K. Balck
CPC classification number: H05K7/209 , H05K7/20909 , H02M5/458
Abstract: An apparatus includes: a power converter including a plurality of electronic switches, the electronic switches being controllable to produce a driver signal having a variable amplitude, frequency, and/or phase; and a single-piece base made of a thermally conductive polymer material. The single-piece base includes: a first side configured to hold the power converter; a second side; and one or more heat dissipating elements that extend from the second side. The heat dissipating elements are configured to dissipate heat generated by the electronic switches, and each of the one or more heat dissipating elements is made of the thermally conductive polymer material.
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公开(公告)号：US20240063727A1
公开(公告)日：2024-02-22
申请号：US18499700
申请日：2023-11-01
Applicant: Eaton Intelligent Power Limited
Inventor： Peter J. Fanduzzi , Paul J. Siebenlist , Mayur Kothari , Michael K. Balck , Sudershan Gawali , Derek Baxter , Craig H. DePas
CPC classification number: H02M7/003 , H02M7/06 , H05K7/209 , H05K7/20909 , H02P27/06
Abstract: A rectifier assembly includes: a mounting base; and one or more rectification modules configured to be received in the mounting base, each rectification module including: an electronic network including one or more electronic elements configured to convert alternating current (AC) electrical power at an input of the rectification module to direct current (DC) electrical power at an output of the rectification module. Each of the one or more rectification modules is configured to be electrically connected to a DC bus of a driving apparatus that is separate from and independent of the rectifier assembly.
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公开(公告)号：US11863083B2
公开(公告)日：2024-01-02
申请号：US17201609
申请日：2021-03-15
Applicant: Eaton Intelligent Power Limited
Inventor： Peter J. Fanduzzi , Paul J. Siebenlist , Mayur Kothari , Michael K. Balck , Sudershan Gawali , Derek Baxter , Craig H. DePas
CPC classification number: H02M7/003 , H02M7/06 , H05K7/209 , H05K7/20909 , H02P27/06
Abstract: A rectifier assembly includes: a mounting base; and one or more rectification modules configured to be received in the mounting base, each rectification module including: an electronic network including one or more electronic elements configured to convert alternating current (AC) electrical power at an input of the rectification module to direct current (DC) electrical power at an output of the rectification module. Each of the one or more rectification modules is configured to be electrically connected to a DC bus of a driving apparatus that is separate from and independent of the rectifier assembly.
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公开(公告)号：US12156328B2
公开(公告)日：2024-11-26
申请号：US18219460
申请日：2023-07-07
Applicant: Eaton Intelligent Power Limited
Inventor： Kaijam M. Woodley , Michael K. Balck , Matthew J. Koebert
Abstract: A circuit board with integrated fusing includes an insulating substrate having a circuit trace formed on a surface thereof, the circuit trace including a first circuit trace portion and a second circuit trace portion. A fusible link electrically connects the first circuit trace portion to the second circuit trace portion, the fusible link including a planar surface extending from the first circuit trace portion to the second circuit trace portion. A dielectric reflow encapsulates the fusible link on the planar surface from the first circuit trace portion to the second circuit trace portion.
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公开(公告)号：US20230354512A1
公开(公告)日：2023-11-02
申请号：US18219460
申请日：2023-07-07
Applicant: Eaton Intelligent Power Limited
Inventor： Kaijam M. Woodley , Michael K. Balck , Matthew J. Koebert
IPC: H05K1/02 , H01H85/046 , H01H85/02 , H01H69/02
CPC classification number: H05K1/0293 , H01H85/046 , H01H85/0241 , H01H69/022 , H01H2085/0275 , H05K2201/10181 , H01H85/08
Abstract: A circuit board with integrated fusing includes an insulating substrate having a circuit trace formed on a surface thereof, the circuit trace including a first circuit trace portion and a second circuit trace portion. A fusible link electrically connects the first circuit trace portion to the second circuit trace portion, the fusible link including a planar surface extending from the first circuit trace portion to the second circuit trace portion. A dielectric reflow encapsulates the fusible link on the planar surface from the first circuit trace portion to the second circuit trace portion.
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