公开(公告)号：US20040192169A1

公开(公告)日：2004-09-30

申请号：US10602034

申请日：2003-06-23

Applicant: Ebara Technologies Incorporated

Inventor： Norio Kimura ,  Huey-Ming Wang ,  Masayuki Kumekawa

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B37/205 ,  B24B49/12

Abstract: The system includes a polishing pad, a pad height sensor; a window; and a window raising mechanism. The polishing pad has an aperture with the window vertically moveable therein. The pad height sensor is positioned above the polishing pad and measures the vertical position of the pad before polishing. The window raising mechanism adjusts the vertical position of the window based on information from the pad height sensor. An endpoint measurement sensor can be disposed beneath the window for in-situ measurement of the polishing process.

Abstract translation: 该系统包括抛光垫，垫高度传感器; 一个窗口; 和升起机构。 抛光垫具有孔，其中窗可在其中垂直移动。 焊盘高度传感器位于抛光垫的上方，并在抛光之前测量焊盘的垂直位置。 窗口提升机构根据来自垫高度传感器的信息来调整窗口的垂直位置。 端点测量传感器可以设置在窗户下方，用于原位测量抛光过程。