公开(公告)号：US5035939A

公开(公告)日：1991-07-30

申请号：US477393

申请日：1990-02-09

申请人： Edward J. Conlon ,  Ashok N. Prabhu ,  Simon M. Boardman ,  Valerie A. Pendrick

发明人： Edward J. Conlon ,  Ashok N. Prabhu ,  Simon M. Boardman ,  Valerie A. Pendrick

IPC分类号： H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

CPC分类号： H05K3/0041 ,  H05K3/4061 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0166 ,  H05K2203/0384 ,  H05K2203/0582 ,  H05K2203/308 ,  H05K3/002 ,  H05K3/4644 ,  H05K3/4667 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/31678

摘要： In the manufacture of printed circuit boards, a first photoresist post is patterned on the substrate where via holes are to be made. A dielectric layer is put down, a second photoresist layer patterned so as to have openings over and in alignment with the photoresist posts, and the dielectric removed from the via holes. Barrier layers to reduce interaction between layers of copper, dielectric and photoresist during filling of the via holes with a conductor via fill ink are also described.

摘要翻译： 在印刷电路板的制造中，在要制造通孔的基板上图案化第一光致抗蚀剂柱。 介电层被放下，图案化的第二光致抗蚀剂层具有在光致抗蚀剂柱上方并与其对准的开口，并且从通孔去除电介质。 还描述了阻挡层，以减少在用导体通过填充油墨填充通孔期间铜，电介质和光致抗蚀剂层之间的相互作用。