公开(公告)号：US20090130384A1

公开(公告)日：2009-05-21

申请号：US11992594

申请日：2006-09-27

申请人： Eiichi Tamiya ,  Yoshiyuki Yokoyama ,  Satoshi Fujiki ,  Katsumi Tanino ,  Atsushi Muraguchi ,  Horoyuki Kishi ,  Yoshiharu Tokimitsu ,  Shohei Yamamura

发明人： Eiichi Tamiya ,  Yoshiyuki Yokoyama ,  Satoshi Fujiki ,  Katsumi Tanino ,  Atsushi Muraguchi ,  Horoyuki Kishi ,  Yoshiharu Tokimitsu ,  Shohei Yamamura

IPC分类号： B32B3/10 ,  C12N11/04 ,  B05D3/00 ,  G03F7/20

CPC分类号： C12N5/0068 ,  C12N2533/12 ,  C12N2535/10 ,  C12N2537/10 ,  C12N2539/10 ,  Y10T428/24273 ,  Y10T436/25 ,  Y10T436/25375

摘要： [Problems] To provide a novel chip useful for treating cells and the like which has a mechanism and a structure wherein the size of a hole pattern is arbitrarily changed so that cells can easily move in and get out from the hole in scattering or collecting cells but can hardly get out from the hole during washing or antigen-stimulation.[Means for Solving Problems] A chip comprising a crosslinked product of a temperature-responsive polymer as a constituting member and being provided with a film having a hole pattern on the surface of a baseboard. A method of producing a chip which comprises a crosslinked product of a temperature-responsive polymer as a constituting member and is provided with a film having a hole pattern on the surface of the baseboard. This method comprises applying a composition containing a crosslinkable temperature-responsive polymer, a composition containing a crosslinkable temperature-responsive polymer and a crosslinking agent or a composition containing a temperature-responsive polymer and a crosslinking agent on the surface of a baseboard to thereby form a coating film, crosslinking the coating film to thereby form the crosslinked product as described above and then forming a hole pattern on the coating film of the crosslinked product.

摘要翻译： [问题]提供一种用于处理细胞等的新颖的芯片，其具有机构和结构，其中孔图案的尺寸任意改变，使得细胞可以容易地在散射或收集细胞中从孔中移出和离开 但在洗涤或抗原刺激期间几乎不能从孔中脱出。 解决问题的手段一种芯片，其包含作为构成部件的温度敏感性聚合物的交联体，并且在基板的表面设置有具有孔图案的膜。 一种制造芯片的方法，其包括作为构成部件的温度敏感性聚合物的交联产物，并且在基板的表面上设置有具有孔图案的膜。 该方法包括在基板的表面上涂布含有交联性温度响应性聚合物的组合物，含有交联性温度敏感性聚合物和交联剂的组合物或含有温度敏感性聚合物和交联剂的组合物，从而形成 使涂膜交联，由此形成如上所述的交联产物，然后在交联产物的涂膜上形成孔图案。