公开(公告)号：US20020084100A1

公开(公告)日：2002-07-04

申请号：US10035932

申请日：2001-12-26

Applicant: Electrolock, Inc.

Inventor： Rick L. Angell ,  Franklin T. Emery ,  Mike E. Lester ,  Mark A. Williams

IPC: H01B007/00

CPC classification number: H02K3/48 ,  H02K3/12 ,  Y10T156/101 ,  Y10T156/1013 ,  Y10T156/103 ,  Y10T156/1036

Abstract: A method for producing an electrically conductive filler by placing a web of core material onto an interior surface of a web of conductive layer material. The webs of core material and conductive layer material are directed through a forming station for folding the conductive layer around the core. The filler having a substantially non-conductive core and a conductive layer. The conductive layer is wrapped around the core to form a closed loop thereby establishing conductivity from a bottom of the filler to a top of the filler by paths on each of two sides of the filler.

Abstract translation: 一种通过将芯材纤维网放置在导电层材料网的内表面上来制造导电填料的方法。 芯材料和导电层材料的纤维网被引导通过成形工位，以将导电层折叠在芯周围。 填料具有基本不导电的芯和导电层。 导电层缠绕在芯上以形成闭环，由此通过在填料的两侧上的路径形成从填料的底部到填料顶部的导电性。