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公开(公告)号：US12216317B2
公开(公告)日：2025-02-04
申请号：US17879008
申请日：2022-08-02
Inventor： Eun Kyu Kang , Jong Jin Lee , Dae Seon Kim , Sang Jin Kwon , Won Bae Kwon , Soo Yong Jung , Hae Chung Kang , Dae Woong Moon , Gye Sul Cho
IPC: G02B6/42
Abstract: A multi-channel optical sub-assembly includes a printed circuit board with a signal processor mounted thereon, a package window mounted on the printed circuit board, the package window including a transparent material, a package mounted on the package window, and an optical device accommodated into an inner space of the package and configured to convert an electrical signal, input from the signal processor, into an optical signal, wherein the electrical signal sequentially passes through a window through electrode buried in the package window and a package through electrode buried in the package and is input to the optical device.
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公开(公告)号：US20190033540A1
公开(公告)日：2019-01-31
申请号：US15807784
申请日：2017-11-09
Inventor： Jeong Eun Kim , Jong Jin Lee , Eun Kyu Kang , Won Bae Kwon , Soo Yong Jung
IPC: G02B6/42
CPC classification number: G02B6/4225 , G02B6/12009 , G02B6/4221 , G02B6/4227 , G02B6/4249
Abstract: Provided are an optical alignment device applied to an assembly process of an optical transmitter and an optical receiver that include multi-channel optical elements and optical waveguide elements for optical communication, and an optical alignment method thereof. The optical alignment device includes an element fixing case with a mounting space formed thereinside and an element insertion hole communicating with the mounting space formed at an upper side thereof, and a light source mounted in the mounting space of the element fixing case and configured to emit light toward a lower side of an optical element or an optical waveguide element which is inserted into the element insertion hole to check a position of a core.
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公开(公告)号：US10459165B2
公开(公告)日：2019-10-29
申请号：US15866697
申请日：2018-01-10
Inventor： Won Bae Kwon , Jong Jin Lee , Eun Kyu Kang , Jeong Eun Kim , Soo Yong Jung
Abstract: The present invention relates to an optical module, and more specifically, to an optical module which allows an optical coupling loss of an optical signal to be minimized and a frequency bandwidth thereof to be maximized. The optical module according to an embodiment of the present invention includes: a circuit substrate; an electronic element mounted on one surface of the circuit substrate; an optical element mounted on another surface perpendicular to the one surface of the circuit substrate; a capacitor mounted between the electronic element and the optical element; and an optical waveguide array on which an optical waveguide is disposed.
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Patent Agency Ranking
公开(公告)号：US10444448B2
公开(公告)日：2019-10-15
申请号：US16042969
申请日：2018-07-23
Inventor： Soo Yong Jung , Jong Jin Lee , Eun Kyu Kang , Won Bae Kwon , Jeong Eun Kim
IPC: G02B6/42
Abstract: Provided are an optical module platform structure and a method of manufacturing the same. The optical module platform structure includes an optical module platform substrate, a light source device mounted on a light source mount attached on one upper side of the optical module platform substrate, a waveguide spaced apart from the light source device by a certain interval and mounted on a waveguide mount attached on the optical module platform substrate, a lens mount fixed between the light source mount and the waveguide mount, and a lens fixed to a top of the lens mount. Therefore, optical coupling efficiency between a light source and a waveguide is maximized by applying a lens mount, and an optical alignment error is minimized.
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公开(公告)号：US12189194B2
公开(公告)日：2025-01-07
申请号：US17862930
申请日：2022-07-12
Inventor： Won Bae Kwon , Jong Jin Lee , Eun Kyu Kang , Soo Yong Jung , Hae Chung Kang , Sang Jin Kwon , Dae Seon Kim
Abstract: An optical receiver sub-assembly is provided, which includes a substrate, an optical waveguide device mounted on the substrate to transfer ray incident from a ray source, and a photodetector mounted on the substrate and disposed under a vertical cross-sectional surface of the optical waveguide device, wherein the ray is sequentially reflected and refracted by an upper slope surface and a lower slope surface provided in the vertical cross-sectional surface and is vertically incident on an active area of the photodetector.
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公开(公告)号：US12021563B2
公开(公告)日：2024-06-25
申请号：US17851148
申请日：2022-06-28
Inventor： Hae Chung Kang , Eun Kyu Kang , Jong Jin Lee , Sang Jin Kwon , Won Bae Kwon , Dae Seon Kim , Dae Woong Moon , Soo Yong Jung , Gye Sul Cho
CPC classification number: H04B10/5053 , G02B6/32 , G02B6/4206 , G02B6/4212 , G02B6/4239 , H04B10/25 , H04B10/50 , H04B10/503
Abstract: A highly integrated multi-channel optical module is provided. The optical module includes an optical source device mounted on a substrate by an optical source mount unit, a waveguide mounted on the substrate by a waveguide mount unit, a lens mount unit disposed between the optical source device and the waveguide and mounted on the substrate, and a lens unit fixed to the lens mount unit by an adhesive cured by ultraviolet (UV) parallel light, wherein a light path of the UV parallel light is formed in the lens mount unit by a reflector attached on a side surface of the lens mount unit, and the UV parallel light moves along the light path and cures the adhesive coated on an upper portion of the lens mount unit facing a lower end portion of the lens unit.
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公开(公告)号：US11239222B2
公开(公告)日：2022-02-01
申请号：US17081536
申请日：2020-10-27
Inventor： Eun Kyu Kang , Jong Jin Lee , Sang Jin Kwon , Won Bae Kwon , Dae Seon Kim , Soo Yong Jung
Abstract: Provided is a cooled optical transmission module device including a silicon wafer having a plurality of platform mounting grooves, each of which serves as a space for mounting in which an optical transmission platform therein, a thermoelectric cooler bonded to the platform mounting groove to transfer heat to outside, the optical transmission platform provided on the thermoelectric cooler and configured to output an optical signal by generating and reflecting the optical signal, a dielectric sub-mount bonded to the platform mounting groove of the silicon wafer and electrically connected to the mounted optical transmission platform, and a cover configured to cover the platform mounting groove of the silicon wafer and seal the platform mounting groove while providing an electric path.
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公开(公告)号：US10459177B2
公开(公告)日：2019-10-29
申请号：US15807784
申请日：2017-11-09
Inventor： Jeong Eun Kim , Jong Jin Lee , Eun Kyu Kang , Won Bae Kwon , Soo Yong Jung
Abstract: Provided are an optical alignment device applied to an assembly process of an optical transmitter and an optical receiver that include multi-channel optical elements and optical waveguide elements for optical communication, and an optical alignment method thereof. The optical alignment device includes an element fixing case with a mounting space formed thereinside and an element insertion hole communicating with the mounting space formed at an upper side thereof, and a light source mounted in the mounting space of the element fixing case and configured to emit light toward a lower side of an optical element or an optical waveguide element which is inserted into the element insertion hole to check a position of a core.
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